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Parker Chomerics THERM-A-FORM T642 Cure-in-Place Potting and Underfill Material

Category Polymer , Thermoset , Silicone
Manufacturer Parker Chomerics
Trade Name THERM-A-FORM
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics THERM-A-FORM T642 Cure-in-Place Potting and Underfill Material.pdf
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Material Notes:
Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.Product Attributes: High thermal performance with flexibility; ideal for underfilling and low outgassingInformation provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 1.50 g/cc
1.50 g/cc
ASTM D792
Viscosity 2.5 cP
2.5 cP
ASTM D2196
Outgassing - Total Mass Loss 0.21 %
0.21 %
CVCM; ASTM D595
0.32 %
0.32 %
TML; ASTM D595
Mechanical Properties Metric English Comments
Hardness, Shore A 70
70
ASTM D2240
Thermal Properties Metric English Comments
CTE, linear 300 µm/m-°C
167 µin/in-°F
ASTM E831
Specific Heat Capacity 1.00 J/g-°C
0.239 BTU/lb-°F
ASTM E1269
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
ASTM D5470
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -50.0 °C
-58.0 °F
Brittleness Temperature -75.0 °C
-103 °F
ASTM D2137
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+13 ohm-cm
1.00e+13 ohm-cm
ASTM D257
Dielectric Constant 4.0

@Frequency 1.00e+6 Hz
4.0

@Frequency 1.00e+6 Hz
ASTM D150
Dielectric Strength 20.0 kV/mm
508 kV/in
ASTM D149
Dissipation Factor 0.0010

@Frequency 1.00e+6 Hz
0.0010

@Frequency 1.00e+6 Hz
Chomerics
Processing Properties Metric English Comments
Cure Time 3.00 min

@Temperature 150 °C
0.0500 hour

@Temperature 302 °F
30.0 min

@Temperature 70.0 °C
0.500 hour

@Temperature 158 °F
2880 min

@Temperature 23.0 °C
48.0 hour

@Temperature 73.4 °F
Pot Life 60.0 min

@Temperature 23.0 °C
60.0 min

@Temperature 73.4 °F
2X Starting Viscosity
Shelf Life 3.00 Month
3.00 Month
From date of Manufacture
Descriptive Properties Value Comments
Binder Silicone
Color Blue
Filler Boron Nitride
Mix Ratio 10:1
Number of Components 2-part
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