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- Parker Chomerics CHO-BOND SV713 Conductive Epoxy
Parker Chomerics CHO-BOND SV713 Conductive Epoxy
| Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive |
| Manufacturer | Parker Chomerics |
| Trade Name | CHO-BOND |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics CHO-BOND SV713 Conductive Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
CHO-BOND® 700 Series Adhesives for Microelectronics Packaging; these pure silver-filled epoxy pastes are designed to meet the demanding requirements of semiconductor and microelectronic packaging. They are one-component systems with a unique combination of excellent die shear strength, low coefficients of thermal expansion, ionic purity, and high thermal and electrical conductivities. Each offers and extended working life with viscosity and thixotropy suitable for both time/pressure and positive displacement dispensing methods. CHO-BOND® SV713 is especially well suited for temperature-sensitive, high performance applications.Information provided by Chomerics
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 2.20 - 2.80 g/cc | 2.20 - 2.80 g/cc | |
| Volatile Organic Compounds (VOC) Content | 0.00 g/l | 0.00 g/l | |
| Solubility in Water | 0.00 % | 0.00 % | Insoluble |
| Thickness | 25.4 microns | 1.00 mil | Recommended |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Shear Strength | 6.89 MPa | 1000 psi | Lap |
| 31.0 MPa | 4500 psi | Die |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Maximum Service Temperature, Air | 150 °C | 302 °F | |
| Minimum Service Temperature, Air | -45.0 °C | -49.0 °F | |
| Flash Point | >= 93.3 °C | >= 200 °F |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Silver, Ag | 60 - 85 % | 60 - 85 % |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.00070 ohm-cm | <= 0.00070 ohm-cm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| 60.0 min @Temperature 125 °C |
1.00 hour @Temperature 257 °F |
||
| Shelf Life | 12.0 Month @Temperature -40.0 °C |
12.0 Month @Temperature -40.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Alkyl Glycidyl Ether wt. % Max | 5 | |
| Amine Compound Proprietary wt. % Max | 10 | |
| Binder | Epoxy | |
| Consistency | Thixotropic Paste | |
| Epoxy Resin, wt % | 15 - 25 | |
| Filler | Ag | |
| Mix Ratio | 1-part | |
| o-Cresyl glycidyle ether wt. % Max | 5 | |
| Working Life | 3 weeks |
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