Momentive Performance Materials TSE326 High Temperature, Heat Cured One Component Silicone Adhesive

TSE326 is a one-component, heat curing silicone adhesive which offers extended performance at temperatures exceeding 200C. A flowable material with primerless adhesion to many substrates, it is suitable for assembly and gasketing where a flowable consistency is required. TSE 326 requires a minimum cure temperature of 100C and offers very low linear shrinkage and an improved thermal conductivity of 0.29 W/m K. Reddish brown in color.Key Performance Properties: One component product-no mixing requiredFast cure at elevated temperaturesPrimerless adhesion to many types of substratesLow linear shrinkageExcellent heat resistanceOutstanding dielectric propertiesGE Silicones became a part of Momentive Performance Materials in 2006.