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Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties  (discontinued **)

Category Polymer , Thermoset , Filled/Reinforced Thermoset , Phenolic
Manufacturer
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties  (discontinued **).pdf
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Material Notes:
Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronics, terminal boards and base plates, housings, mounting parts, motor ignition systems.Information provided by Bak AGBak AG became a part of Hexion in 2005.
Physical Properties Metric English Comments
Density 1.43 g/cc
0.0517 lb/in³
ISO 1183
Apparent Bulk Density 0.600 g/cc
0.0217 lb/in³
ISO 60
Linear Mold Shrinkage, Flow 0.0040 cm/cm
0.0040 in/in
Compression molding; ISO 2577
0.0080 cm/cm
0.0080 in/in
Injection molding; ISO 2577
Mechanical Properties Metric English Comments
Ball Indentation Hardness 300 MPa
43500 psi
H 961/30; ISO 2039/P1
Flexural Strength 115 MPa
16700 psi
2 mm/min; ISO 178
Flexural Modulus 8.00 GPa
1160 ksi
ISO 178
Charpy Impact Unnotched 0.800 J/cm²

@Temperature 23.0 °C
3.81 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eU
Charpy Impact, Notched 0.150 J/cm²

@Temperature 23.0 °C
0.714 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eA
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 140 °C
284 °F
<20000 hours; IEC 60216-P1
180 °C
356 °F
< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa 115 °C
239 °F
ISO 75-2
Shrinkage 0.500 %

@Temperature 110 °C
0.500 %

@Temperature 230 °F
Compression molding; ISO 2577
1.00 %

@Temperature 110 °C,
Time 605000 sec
1.00 %

@Temperature 230 °F,
Time 168 hour
Injection molding; ISO 2577
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+12 ohm-cm
1.00e+12 ohm-cm
IEC 60093
Surface Resistance 1.00e+11 ohm
1.00e+11 ohm
IEC 60093
Dielectric Constant 6.0

@Frequency 100 Hz
6.0

@Frequency 100 Hz
IEC 60250
Dielectric Strength 30.0 kV/mm

@Thickness 1.00 mm
762 kV/in

@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.10

@Frequency 100 Hz
0.10

@Frequency 100 Hz
IEC 60250
Comparative Tracking Index 125 V
125 V
Test liquid A; IEC 60112
Processing Properties Metric English Comments
Feed Temperature 60.0 - 75.0 °C
140 - 167 °F
Injection molding
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Melt Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Mold Temperature 160 - 190 °C
320 - 374 °F
Injection molding
160 - 190 °C
320 - 374 °F
Compression molding
Injection Pressure >= 15.0 MPa
>= 2180 psi
Compression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa
72.5 - 290 psi
Injection molding
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Descriptive Properties Value Comments
Chromatic Spectrum Subdued Colors
Creep Rupture Strength Good
Holding Pressure Approximately 40-60% of injection pressure
Media Resistance Good
Moisture Absorption 35 mg
ISO 62, 24 hours at 23°C
Reserves by Peak Temperature High
Thermal Expansion Slight
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