Polymer Property : Back Pressure = 290 psi Product List

Processing Properties

Tips: 30 items are displayed at most.

Processing Properties	Metric	English	Comments
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC T4020 H Polypropylene Copolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC TS20020 UV Polypropylene Copolymer, Mineral Reinforced, UV-Stabilized Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC TS8030 Polypropylene Copolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF3050 PD2 Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF5020 PB Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH T8040 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH TS15010 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH TS15020 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PP TOUCH 25325 R3 Polypropylene, Glass Fiber Reinforced, Scratch Resistant Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF8030 HC Polypropylene Homopolymer, Glass Fibre-Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF8030 PD1 VT2 PP, Glass Fiber-Reinforced, Chemically Coupled Heat Stabilized Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH MGF5040 Polypropylene Homopolymer, Multifiller Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH T15020 H4 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength & Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued ** Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed  (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi	Mold Pressure
Beijing Chemical Industry KAIFA® GL5200 ABS Extrusion Grade Non-toxic, Superior impact strength at low temp., High gloss, Uniform sheet thickness for vacuum moldingInformation provided by Beijing Chemical Industry Research Institute (Group)
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF8020 PB Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH T20040 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH T5038 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH TS4020 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH TS8030 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage  (disconti Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed &n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou..