Polymer Property : Back Pressure = 290 psi Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PP HIP15025 HC Polypropylene Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC T20040 Polypropylene Copolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC TS15020E Polypropylene Copolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC TS8030 Polypropylene Copolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GK8020D Polypropylene Homopolymer, Glass Reinforced, Detergent Resistant Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH K20020 D Polypropylene Homopolymer, Mineral Reinforced, Detergent Resistant Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH T4020 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PP HIP8040 VT2 Polypropylene, Mineral Reinforced, Heat Resistant Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC K5040 E30 Polypropylene Copolymer, Mineral Reinforced, Elastomer Modified Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC T10030 Polypropylene Copolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF10030 PD2 Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF3030 PD2 PP, Glass Fiber-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF4030 PD2 Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF5030 PD2 Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF8030 HC Polypropylene Homopolymer, Glass Fibre-Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF8030 PD1 VT2 PP, Glass Fiber-Reinforced, Chemically Coupled Heat Stabilized Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH K20020 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi	Mold Pressure
Beijing Chemical Industry KAIFA® GL2100 ABS Good Flow Grade Good flow, Easy processing, High glossInformation provided by Beijing Chemical Industry Research Institute (Group)
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF10020 PD2 Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH TS15030 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH TS4040 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPHC T11030 Polypropylene, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage Epoxy molding compound, inorganically filled, glass fiber reinforced, heat resistant, dimensionally stable, good electrical and mechanical properties, very good chemical resistance, low viscosity, U..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage (disconti Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..