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Polymer Property : Mold Temperature = 190 °C Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LARPEEK 10 G/50 50% Glass Reinforced Polyetheretherketone (PEEK)
(Unverified Data**) Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°.. |
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LARPEEK 10 K/40 40% Carbon Fiber Reinforced Polyetheretherketone (PEEK)
(Unverified Data**) Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | |
| Solvay Specialty Polymers AvaSpire® AV-651 GF30 Polyaryletherketone (PAEK)
(Unverified Data**) AvaSpire AV-651 GF30 is a 30% glass fiber reinforced polyaryletherketone (PAEK) that has been specifically formulated to provide higher mechanical strength and stiffness than unfilled AV-651 resin. .. |
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | Long flow or thin wall parts or for low residual stress |
| Solvay Specialty Polymers Supradel® HTS-2401 High Temperature Sulfone Resin
(discontinued **) Supradel HTS-2401 is a high-temperature high-performance amorphous sulfone polymer designed for use in reinforced high temperature thermoplastic formulations. With its glass transition temperature o.. |
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | Injection molding |
| Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
(dis Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical even at higher temperatures, very slight post shrinkage, increased media resistance, UL l.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties
(discontinued **) Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties
(discontinued **) Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued ** Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed
(disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, hi.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak .. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ X30 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak.. |
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| Mold Temperature | 150 - 190 °C | 302 - 374 °F | |
| LATI Latiohm 85-06 PD01 G/15 PES, 15% Glass Fiber Reinforced Semiconductive/dissipative product based on Polyether Sulfone (PES). Glass fibers.Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation provided by Lati I.. |
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| Mold Temperature | 150 - 190 °C | 302 - 374 °F | Injection molding |
| BASF Ultrason® E 2010 G4 MR SW 15102 20% Glass Filled PESU Information provided by BASF |
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LARPEEK 50 G/20 20% Glass Reinforced Polyetheretherketone (PEEK)
(discontinued **) Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant.Application areas: Thermally and dyna.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage
(disconti Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 4041 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled, elasticized. Very good heat resistance, very good mechanical properties, reduced mold shrinkage and post-shrinkage, good .. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed
&n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte.. |
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