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Polymer Property : Mold Temperature = 190 °C Product List
Processing PropertiesTips: 30 items are displayed at most.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
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LATI LARPEEK 10 K/30 30% Carbon Fiber Reinforced Polyetheretherketone (PEEK)
(Unverified Data**)
Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°..
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
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LATI LARPEEK 50 G/30 30% Glass Reinforced Polyetheretherketone (PEEK)
(Unverified Data**)
Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°..
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
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LATI LARPEEK 50 G/40 40% Glass Reinforced Polyetheretherketone (PEEK)
(discontinued **)
Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°..
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
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LATI LATILUB 88/50-30GRT PEEK Based, 30% Graphite and PTFE Self Lubricating Plastic
(Unverified Data**)&l
Latilub self-lubricating plastic materials are designed to replace metals in applications such as gears, bushings, cams, slides, etc., for which, besides their intrinsic properties (moldability, low..
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | Long flow or thin wall parts or for low residual stress |
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Solvay Specialty Polymers Supradel® HTS-2401 High Temperature Sulfone Resin
(discontinued **)
Supradel HTS-2401 is a high-temperature high-performance amorphous sulfone polymer designed for use in reinforced high temperature thermoplastic formulations. With its glass transition temperature o..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
(dis
Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical even at higher temperatures, very slight post shrinkage, increased media resistance, UL l..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed
(discontinued **)
Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets
(discontinued **)
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed
(discontinued **)
Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, ..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures
(disconti
Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application ..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued **
Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed
&nbs
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed
&nbs
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, hi..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed
(discontinued **)
Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **)
Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin
(discontinued **)
Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed
(discontinued **)
Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
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| Mold Temperature | 150 - 190 °C | 302 - 374 °F | |
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LATI Latilub 85-10T G/30 PES, 30% Glass Fiber Reinforced, PTFE Filled
Self-lubricating product based on Polyether Sulfone (PES). PTFE. Glass fibers. Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation provided by Lati Indu..
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| Mold Temperature | 150 - 190 °C | 302 - 374 °F | Injection molding |
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BASF Ultrason® E 2010 G4 MR SW 15102 20% Glass Filled PESU
Information provided by BASF
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| Mold Temperature | 93.0 - 190 °C | 199 - 374 °F | Average value: 155 °C Grade Count:23 |
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Overview of materials for Polyethersulfone (PES), 20% Glass Fiber Filled
This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone (PES), 20% Glass Fiber Filled". Each property range of values reported is minimum and m..
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | |
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Raschig Group 5557 DAP
(discontinued **)
Glass fiber-reinforced and inorganically filled diallylphthalate molding compound (DAP) in various colors. Good mechanical strength together with retention of high electrical properties under hot h..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
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Hexion Bakelite™ PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant.Application areas: Thermally and dyna..
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| Mold Temperature | 143 - 190 °C | 289 - 374 °F | Average value: 172 °C Grade Count:9 |
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Overview of materials for Epoxy, Molded, Glass Fiber Filler
This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Molded, Glass Fiber Filler". Each property range of values reported is minimum and maximum values..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 4041 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **)
Phenolic molding compound, glass fiber reinforced and inorganically filled, elasticized. Very good heat resistance, very good mechanical properties, reduced mold shrinkage and post-shrinkage, good ..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **)
Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 1142 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **)
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability, good mechanical properties.Application areas: Insulating flanges, sealings, pulleys.Information p..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs
Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed
Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou..
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
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Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..
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