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Polymer Property : Mold Temperature = 190 °C Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LATILUB 88/50-20GRT K/10 PEEK Based, 10% Carbon Fiber Reinforced, 20% Graphite and PTFE Self Lubricating Plastic Latilub self-lubricating plastic materials are designed to replace metals in applications such as gears, bushings, cams, slides, etc., for which, besides their intrinsic properties (moldability, low.. |
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LATILUB 88/50-30GRT PEEK Based, 30% Graphite and PTFE Self Lubricating Plastic
(Unverified Data**)&l Latilub self-lubricating plastic materials are designed to replace metals in applications such as gears, bushings, cams, slides, etc., for which, besides their intrinsic properties (moldability, low.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | |
| Solvay Specialty Polymers AvaSpire® AV-651 GF30 Polyaryletherketone (PAEK)
(Unverified Data**) AvaSpire AV-651 GF30 is a 30% glass fiber reinforced polyaryletherketone (PAEK) that has been specifically formulated to provide higher mechanical strength and stiffness than unfilled AV-651 resin. .. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties
(discontinued **) Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, .. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures
(disconti Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application .. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive
(discontinued **) Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive
(discontinued **) Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005.. |
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| Mold Temperature | 150 - 190 °C | 302 - 374 °F | |
| LATI Lapex R G/10 PPSU, 10% Glass Reinforced Polyphenylene Sulfone (PPSU) based compound. Glass fibers. Low smoke density and low toxicity index. Very high dimensional stability.Availability: Africa & Middle East; Asia Pacific; Europe; Latin A.. |
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI Latigray 88/10-01 CX/30 PEEK Radiopaque compound based on Polyetheretherketone (PEEK). Special mineral filler. Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation provided by Lati I.. |
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| Mold Temperature | 150 - 190 °C | 302 - 374 °F | |
| LATI Latilub 85-10T G/30 PES, 30% Glass Fiber Reinforced, PTFE Filled Self-lubricating product based on Polyether Sulfone (PES). PTFE. Glass fibers. Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation provided by Lati Indu.. |
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| Mold Temperature | 150 - 190 °C | 302 - 374 °F | |
| LATI Latiohm 85-06 PD01 G/15 PES, 15% Glass Fiber Reinforced Semiconductive/dissipative product based on Polyether Sulfone (PES). Glass fibers.Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation provided by Lati I.. |
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| Mold Temperature | 150 - 190 °C | 302 - 374 °F | Injection molding |
| BASF Ultrason® E 2010 G4 MR SW 15102 20% Glass Filled PESU Information provided by BASF |
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| Mold Temperature | 150 - 190 °C | 302 - 374 °F | Injection molding |
| BASF Ultrason® KR 4113 PESU with 10/10% Carbon Fibers/Graphite and 10% PTFE Description: Compound based on PES with 30 % filler. The filler system, a mixture of carbon fibers, graphite and PTFE powder, considerably improves Ultrason’s tribological properties. In addition, .. |
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LARPEEK 50 G/20 20% Glass Reinforced Polyetheretherketone (PEEK)
(discontinued **) Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°.. |
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| Mold Temperature | 135 - 190 °C | 275 - 374 °F | Average value: 157 °C Grade Count:17 |
| Overview of materials for Polyethersulfone (PES), 30% Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone (PES), 30% Glass Fiber Filled". Specific grades with glass content between 25% and 34% .. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage Epoxy molding compound, inorganically filled, glass fiber reinforced, heat resistant, dimensionally stable, good electrical and mechanical properties, very good chemical resistance, low viscosity, U.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m.. |
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| Mold Temperature | 143 - 190 °C | 289 - 374 °F | Average value: 172 °C Grade Count:9 |
| Overview of materials for Epoxy, Molded, Glass Fiber Filler This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Molded, Glass Fiber Filler". Each property range of values reported is minimum and maximum values.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 4041 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled, elasticized. Very good heat resistance, very good mechanical properties, reduced mold shrinkage and post-shrinkage, good .. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Galvanized, Conductive
(di Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Application areas: Bearers f.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 83 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Switch covers, rolls, handle casings.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte.. |
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