Thermal Properties | Metric | English | Comments |
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CTE, linear | 50.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
27.8 µin/in-°F @Temperature 73.4 - 140 °F |
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Omnia Plastica PEI Polyetherimide This high performance engineering plastic is a non-reinforced self-extinguishing amorphous polymer with high thermal, electrical and mechanical properties which are typical of a crystalline polymer... |
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CTE, linear | 50.0 µm/m-°C @Temperature 23.0 - 100 °C |
27.8 µin/in-°F @Temperature 73.4 - 212 °F |
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Quadrant EPP Duratron® PEI U1000 PEI, unfilled, extruded (ISO Data) Duratron U1000 PEI is an amber translucent (non-optical quality) amorphous thermoplastic material, offering high strength and heat resistance. It performs continuously to 170 °C, making it ideal fo.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 20.0 °C |
27.8 µin/in-°F @Temperature 68.0 °F |
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North Wood Plastics Polypropylene with 40% Wood Fiber, Extrusion Grade Data provided by North Wood Plastics, Inc. |
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CTE, linear | 50.0 µm/m-°C @Temperature 20.0 °C |
27.8 µin/in-°F @Temperature 68.0 °F |
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North Wood Plastics Polypropylene with 40% Wood Fiber, Molding Grade Data provided by North Wood Plastics, Inc. |
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CTE, linear | 50.0 - 60.0 µm/m-°C @Temperature 50.0 - 100 °C |
27.8 - 33.3 µin/in-°F @Temperature 122 - 212 °F |
ISO 11359-2 |
Raschig Group 6552 DAIP Glass-fiber reinforced diallyl isophthalate molding compound. Good mechanical strength together with retention of high electrical isolation properties under hot humid conditions, exceptional dimensi.. |
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CTE, linear | 50.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
27.8 µin/in-°F @Temperature -22.0 - 176 °F |
ASTM E228 |
Solvay Engineered Polymers SEQUEL® 1820 Engineered Polyolefin
(discontinued **) Description: SEQUEL® 1820 engineered polyolefin is designed for automotive exterior applications that require energy management combined with excellent ductility and stiffness over a broad temperat.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
27.8 µin/in-°F @Temperature 73.4 - 140 °F |
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Omnia Plastica PA6 GF Akulon GF - Dry Polyamide 6 reinforced with the addition of 30% glass fibre and graphite. The glass charge makes the material highly resistant to abrasion, compression and flexing. Akulon GF is particularly suitabl.. |
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CTE, linear | 50.0 - 70.0 µm/m-°C @Temperature 20.0 °C |
27.8 - 38.9 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
Polycasa SAN QUINN SAN sheets are characterized by good optical properties and a brilliant surface. The QUINN SAN range contains sheets that are easy to handle, to vacuum form, and show a very good dimensional s.. |
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CTE, linear | 50.0 µm/m-°C | 27.8 µin/in-°F | Below Tg |
EVALCA EVAL® F100 Ethylene Vinyl Alcohol Copolymer Resin
(discontinued **) 32 mol % Ethylene.Data provided by EVALCA. Applications: Melt phase forming. EVOH is used in packaging applications because of its outstanding gas barrier properties.EVAL™ is now produced as a pa.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 20.0 °C |
27.8 µin/in-°F @Temperature 68.0 °F |
Vertical Direction; ASTM D696 |
Mitsui Arlen™ C230 30% Glass Fiber-Reinforced Modified Nylon 6T (DAM) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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CTE, linear | 50.0 µm/m-°C @Temperature -30.0 - 100 °C |
27.8 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
LyondellBasell Hifaxâ„¢ BB222GC Thermoplastic Olefin Resin Key Features: medium melt flow, very high modulus, UV-stabilized thermoplastic elastomeric olefin resin, excellent impact and stiffness balance, excellent weatherability, high stiffness, good dimens.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 20.0 °C |
27.8 µin/in-°F @Temperature 68.0 °F |
ISO 11359 |
Teijin Panlite® G-3330M Isotropic, Glass Fiber Reinforced Polycarbonate Resin Reinforced with 30 % of special GF and least anisotropy grade, meeting UL 94 V-2.Applications:Mechanical, electric and electronic components that need good appearance and mechanical propertyPrecisio.. |
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CTE, linear | 50.0 - 70.0 µm/m-°C | 27.8 - 38.9 µin/in-°F | ASTM D696 |
Samyang Trirex® 3020A Polycarbonate with Heat Stabilizer PC is characterized by its excellent impact resistance, dimensional stability and excellent thermal resistance.3020A is a high flow grade with heat stabilizers.Information provided by Samyang. |
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CTE, linear | 50.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
27.8 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics NORYL INT1512 PPE+HIPS (Asia Pacific) PPE/HIPS GF filled for auto interior |
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CTE, linear | 50.0 - 55.0 µm/m-°C | 27.8 - 30.6 µin/in-°F | |
Master Bond EP21HTND High Temperature Resistant, Non-Drip Epoxy Compound Description: Master Bond EP21HTND is a two component, room temperature curing epoxy adhesive, sealant and coating with a paste viscosity and non-drip application feature. Its features are easy handl.. |
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CTE, linear | 50.0 µm/m-°C @Temperature 20.0 °C |
27.8 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond 2122 Metal Repair Aluminum Epoxy Adhesive TRA-BOND 2122 is a versatile aluminum metal filled epoxy formulation developed for modern industrial casting, bonding and repair applications where a strong aluminum-like adhesive is required. This .. |
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CTE, linear | 50.0 µm/m-°C @Temperature 40.0 - 130 °C |
27.8 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 4311 Phenolic, Granular, Injection Molded PLENCO 04311 is a heat resistant, mineral filled phenolic molding compound offering excellent processability, mechanical strength, and improved cold powder pourability characteristics. UL recognized.. |
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CTE, linear | >= 50.0 µm/m-°C | >= 27.8 µin/in-°F | |
Epoxyset Epoxibond EB-107LP-2 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc. |
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CTE, linear | 50.0 µm/m-°C @Temperature 20.0 °C |
27.8 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Covestro Bayflex® XGT-100 Polyurethane Elastomeric RIM, 15% Milled Glass Filled, MDI-based 2-Component Liquid System 0.125 in. thickness. RIM = Reaction Injection MoldingInformation provided by Bayer Corporation, Polyurethanes DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and of.. |
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CTE, linear | 50.0 - 55.0 µm/m-°C @Temperature 20.0 °C |
27.8 - 30.6 µin/in-°F @Temperature 68.0 °F |
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Abatron AboCast/AboCure 8109-13 Liquid hardener version of AboCast/AboCure 8109-11.Processing: 100/23 pbw; Potlife: 3-5 h/20°C (68°F), 1-3 h/40°C (105°F), 0.5-1 h/60°C (140°F); mix at RT; cures in: 30 mins/60°C (140°F), 45.. |
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CTE, linear | >= 50.0 µm/m-°C | >= 27.8 µin/in-°F | |
Epoxyset Epoxibond EB-177 Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc... |
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CTE, linear | >= 50.0 µm/m-°C @Temperature 20.0 °C |
>= 27.8 µin/in-°F @Temperature 68.0 °F |
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Loctite® 3888 Room Temperature Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |
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CTE, linear | 50.0 µm/m-°C | 27.8 µin/in-°F | |
Resinlab® EP1199 Clear Unfilled Epoxy Adhesive Resinlab™ EP1199 Clear is a two part unfilled epoxy adhesive designed for bonding of metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and.. |
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CTE, linear | 50.0 - 55.0 µm/m-°C | 27.8 - 30.6 µin/in-°F | |
Master Bond EP30M4LV Chemically Resistant, Low Viscosity Adhesive Description: Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weig.. |