Polymer Property : CTE, linear = 50.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	50.0 µm/m-°C @Temperature 23.0 - 60.0 °C	27.8 µin/in-°F @Temperature 73.4 - 140 °F	dry sample
Omnia Plastica Rilsan® PA6 GF - Akulon GF - at 50% RH Polyamide 6 reinforced with the addition of 30% glass fibre and graphite. The glass charge makes the material highly resistant to abrasion, compression and flexing. Akulon GF is particularly suitabl..
CTE, linear	50.0 - 70.0 µm/m-°C	27.8 - 38.9 µin/in-°F	Polykemi
Polykemi AB POLYfill PP CIM9040 Polypropylene, Mineral Reinforced Information provided by Polykemi AB
CTE, linear	50.0 µm/m-°C @Temperature 23.0 - 100 °C	27.8 µin/in-°F @Temperature 73.4 - 212 °F
Quadrant EPP Techtron® HPV PPS + solid lubricant, bearing grade, extruded (ISO Data) As a reinforced, internally lubricated PPS grade, Techtron HPV PPS demonstrates an excellent combination of properties including wear resistance, load-bearing capabilities and dimensional stability ..
CTE, linear	50.0 µm/m-°C @Temperature -30.0 - 80.0 °C	27.8 µin/in-°F @Temperature -22.0 - 176 °F	ASTM E228
Solvay Engineered Polymers SEQUEL® 1820 Engineered Polyolefin (discontinued **) Description: SEQUEL® 1820 engineered polyolefin is designed for automotive exterior applications that require energy management combined with excellent ductility and stiffness over a broad temperat..
CTE, linear	50.0 - 90.0 µm/m-°C	27.8 - 50.0 µin/in-°F	Average value: 76.0 µm/m-°C Grade Count:25
Overview of materials for Polystyrene, Molded, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Polystyrene". Each property range of values reported is minimum and maximum values of appropriate MatWeb..
CTE, linear	50.0 µm/m-°C	27.8 µin/in-°F	Below Tg
EVALCA EVAL® F100 Ethylene Vinyl Alcohol Copolymer Resin (discontinued **) 32 mol % Ethylene.Data provided by EVALCA. Applications: Melt phase forming. EVOH is used in packaging applications because of its outstanding gas barrier properties.EVAL™ is now produced as a pa..
CTE, linear	50.0 - 171 µm/m-°C @Temperature 25.6 - 300 °C	27.8 - 95.0 µin/in-°F @Temperature 78.0 - 572 °F	Average value: 110 µm/m-°C Grade Count:11
Overview of materials for Polytetrafluoroethylene (PTFE), Glass Filled, Molded This property data is a summary of similar materials in the MatWeb database for the category "Polytetrafluoroethylene (PTFE), Glass Filled, Molded". Each property range of values reported is minimum..
CTE, linear	50.0 - 150 µm/m-°C	27.8 - 83.3 µin/in-°F	Average value: 96.4 µm/m-°C Grade Count:20
Overview of materials for Nylon 12, Extrusion/Tubing Grade This property data is a summary of similar materials in the MatWeb database for the category "Nylon 12, Extrusion/Tubing Grade". Each property range of values reported is minimum and maximum values ..
CTE, linear	50.0 Âµm/m-Â°C	27.8 Âµin/in-Â°F	DIN 53752
Lehmann & Voss LUVOCOMÂ® 1/GK/30/TF/13/SI/2 Polyamide 66, with glass spheres, PTFE, lubricant modified, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Improved friction and wear behaviour. Emergency running property.Low warpage, isotropic shrinka..
CTE, linear	50.0 - 55.0 µm/m-°C	27.8 - 30.6 µin/in-°F
Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien..
CTE, linear	50.0 µm/m-°C @Temperature 20.0 °C	27.8 µin/in-°F @Temperature 68.0 °F	DIN 53752
Borealis Daplen™ EG203AE Polypropylene Compound Elastomer and Mineral Modified Daplen EG203AE is a 20% mineral and elastomer modified polypropylene compound intended for injection molding. Daplen EG203AE is a material with excellent impact /stiffness ratio. Thanks to its low ..
CTE, linear	50.0 µm/m-°C	27.8 µin/in-°F	ISO 11359-2
Unitika A3130 PA6, 35% Mineral Reinforced, Conditioned Information provided by Unitika Ltd.
CTE, linear	50.0 µm/m-°C @Temperature 40.0 - 130 °C	27.8 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 4485 Phenolic, Granular, Injection Molded PLENCO 04485 is a mineral filled phenolic molding compound offering excellent heat resistance, electrical resistance, and dimensional stability. UL recognized under component file E40654. 04485 is a..
CTE, linear	<= 50.0 µm/m-°C @Temperature 20.0 °C	<= 27.8 µin/in-°F @Temperature 68.0 °F
Loctite® 3445 1 component fusible solder filler Anisotropic Epoxy Adhesive Electrically Conductive Bonding and Encapsulants and UnderfillsLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a ..
CTE, linear	50.0 µm/m-°C	27.8 µin/in-°F	MIL STD 883D
CoorsTek Epoxy Seal 216 (ES-216) B-staged epoxy lids ES-216 is available for applications where high strength and moisture resistance are required. It displays fillet formation characteristics and, after cure, is highly temperature and moisture resist..
CTE, linear	50.0 µm/m-°C @Temperature 23.0 - 80.0 °C	27.8 µin/in-°F @Temperature 73.4 - 176 °F	DIN 53752
CP-Polymer-Technik Wellamid® 6600 GS 30 HWCP 30% Glass Sphere Filled Nylon 66, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG
CTE, linear	50.0 µm/m-°C @Temperature 23.0 - 260 °C	27.8 µin/in-°F @Temperature 73.4 - 500 °F	ASTM D696
Daelim H&L Plavis-N ISO Unfilled Aromatic Polyimide Bearing Isostatically Molded. Plavis-N: Best physical properties, maximum electrical and thermal insulation, low out-gassing, superior radiation resistance.General Plavis information for all grades:PLAVIS ..
CTE, linear	>= 50.0 µm/m-°C	>= 27.8 µin/in-°F
Epoxyset Epoxibond EB-135 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries. EB-135 has excellent bond strength to various substrat..
CTE, linear	50.0 - 90.0 µm/m-°C @Temperature 23.0 - 60.0 °C	27.8 - 50.0 µin/in-°F @Temperature 73.4 - 140 °F	ASTM D696
Daikin NEOFLON EP-620 ETFE Pellets Due to its excellent melt flow properties, NEOFLON ETFE can be processed in the same was as other thermoplastic resins. NEOFLON ETFE is also highly suited to such secondary processes as welding, fl..
CTE, linear	50.0 - 55.0 µm/m-°C @Temperature 20.0 °C	27.8 - 30.6 µin/in-°F @Temperature 68.0 °F
Abatron AboCast/AboCure 8109-13 Liquid hardener version of AboCast/AboCure 8109-11.Processing: 100/23 pbw; Potlife: 3-5 h/20°C (68°F), 1-3 h/40°C (105°F), 0.5-1 h/60°C (140°F); mix at RT; cures in: 30 mins/60°C (140°F), 45..
CTE, linear	50.0 µm/m-°C @Temperature -30.0 - 30.0 °C	27.8 µin/in-°F @Temperature -22.0 - 86.0 °F	ASTM Test
BASF Ultramid® 8260 40% Mineral Filled PA6 (Dry) Ultramid 8260 is a 40% mineral reinforced PA6 injection molding compound. It possesses high stiffness, dimensional stability and heat resistance combined with excellent processability including low..
CTE, linear	50.0 µm/m-°C @Temperature -30.0 - 30.0 °C	27.8 µin/in-°F @Temperature -22.0 - 86.0 °F	ASTM D696
Beijing Chemical Industry KAIFA® 201-G30R PBT Resin 30% glass fiber reinforced, good flow and toughnessInformation provided by Beijing Chemical Industry Research Institute (Group)
CTE, linear	50.0 µm/m-°C	27.8 µin/in-°F
Resinlab® EP1282 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat..