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Epoxy Technology EPO-TEK® 353ND Black High Temperature Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, High Temperature
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® 353ND Black High Temperature Epoxy.pdf
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Material Notes:
Product Description: EPO TEK® 353ND Black is a a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applicationsAdvantages & Application Notes: EPO TEK® 353ND-BLACK has been color-coded black for optical applications requiring opacity against light in IR and VIS region. Reasonable pot-life that allows for low temperature curing to be realized. Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill. Hybrid suggested applications: providing near hermetic seals in sensor devices, resisting high temperature packaging. Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications: Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays Down-Hole petrochemical fiber optic sensors, resisting >200 C field conditions Medical suggested applications: Potting Fiber Optic bundles into SST ferrules for light guides and endoscopes, resisting sterilization cycles of autoclave, ETO, gamma, H202 plasmaElectronics Assembly suggested applications: Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets Structural grade epoxy found in hard-disk drive devices; bonding of SST metals, kapton, and magnetsInformation Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.02 g/cc
1.02 g/cc
Part B
1.22 g/cc
1.22 g/cc
Part A
Viscosity 3000 - 5000 cP

@Temperature 23.0 °C
3000 - 5000 cP

@Temperature 73.4 °F
50 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
Tensile Modulus 3.56 GPa
517 ksi
Storage
Shear Strength >= 13.8 MPa
>= 2000 psi
Lap
>= 35.2 MPa
>= 5100 psi
Die
Thermal Properties Metric English Comments
CTE, linear 54.0 µm/m-°C
30.0 µin/in-°F
Below Tg
206 µm/m-°C
114 µin/in-°F
Above Tg
Maximum Service Temperature, Air 225 °C
437 °F
Continuous
325 °C
617 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 90.0 °C
>= 194 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 420 °C
788 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity >= 1.60e+13 ohm-cm
>= 1.60e+13 ohm-cm
Dielectric Constant 3.09

@Frequency 1000 Hz
3.09

@Frequency 1000 Hz
Dissipation Factor 0.0050

@Frequency 1000 Hz
0.0050

@Frequency 1000 Hz
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 52 ppm
52 ppm
Ionic Impurities - K (Potassium) 16 ppm
16 ppm
Ionic Impurities - Cl (Chloride) 595 ppm
595 ppm
Processing Properties Metric English Comments
Cure Time 1.00 min

@Temperature 150 °C
0.0167 hour

@Temperature 302 °F
Minimum Bond Line
5.00 min

@Temperature 120 °C
0.0833 hour

@Temperature 248 °F
Minimum Bond Line
10.0 min

@Temperature 100 °C
0.167 hour

@Temperature 212 °F
Minimum Bond Line
30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
Minimum Bond Line
Pot Life 180 - 240 min
180 - 240 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Amber
Part B
Black
Part A
Consistency Pourable liquid
Ionic Impurities NH4 1149 ppm
Mix Ratio By Weight 10:1
Number of Components Two
Weight Loss 0.92%
200°C
1.24%
250°C
1.83%
300°C
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