Atom Adhesives AA-BOND 2112 Epoxy Adhesive

AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics. AA-BOND 2112 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics. AA-BOND 2112 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. The cured adhesive provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.Appearance: Milky TranslucentCure Type: Heat cure or Room TemperatureBenefits:Tough enamel like cureBonds variety of substratesGood electrical insulationWeather resistant Mix Ratio by weight: 100:22/Resin:HardenerSubstrates: metals, glass, ceramics, wood and many plasticsTypical Application: Printed circuit board repair, staking components, bonding, laminating and repair applicationsInformation provided by Atom Adhesives