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Polymer Property : Mold Temperature = 374 °F Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LARPEEK 50 G/40 40% Glass Reinforced Polyetheretherketone (PEEK)
(discontinued **) Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°.. |
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LATILUB 88/50-30GRT PEEK Based, 30% Graphite and PTFE Self Lubricating Plastic
(Unverified Data**)&l Latilub self-lubricating plastic materials are designed to replace metals in applications such as gears, bushings, cams, slides, etc., for which, besides their intrinsic properties (moldability, low.. |
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | |
| Raschig Group 3572 Epoxy Glass-fiber reinforced epoxy molding compound. Good mechanical strength and electrical strength, enhanced elasticity for ensuring good sealing under extreme heat and/or humidity, good chemical resis.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, .. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, .. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued ** Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed
&nbs Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed
&nbs Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive
(discontinued **) Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak .. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati.. |
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | |
| Lehmann & Voss LUVOCOM® PEEK CLASSIX 7994 PEEK, unreinforced Applications: medical engineeringEspecially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceHigh chemical resistance parts, non flammable.Inherent flame resistance.S.. |
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | |
| Lehmann & Voss LUVOCOM® PEEK CLASSIX 7980 PEEK, with carbon fiber Applications: medical engineeringHigh-strength and high-stiff parts; low coefficient of expansion.Dynamic stressed parts at high movement velocity.Chemical and hydrolysis resistance parts, non flamm.. |
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| Mold Temperature | 150 - 190 °C | 302 - 374 °F | |
| LATI Lapex R G/10 PPSU, 10% Glass Reinforced Polyphenylene Sulfone (PPSU) based compound. Glass fibers. Low smoke density and low toxicity index. Very high dimensional stability.Availability: Africa & Middle East; Asia Pacific; Europe; Latin A.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | |
| Solvay Specialty Polymers AvaSpire® AV-651 GF30 Polyaryletherketone (PAEK), 30% Glass Fiber AvaSpire® AV-651 GF30 is a 30% glass fiber reinforced polyaryletherketone (PAEK) that has been specifically formulated to provide higher mechanical strength and stiffness than unfilled AV-651 res.. |
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| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LARPEEK 50 G/20 20% Glass Reinforced Polyetheretherketone (PEEK)
(discontinued **) Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°.. |
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| Mold Temperature | 170 - 190 °C | 338 - 374 °F | |
| Raschig Group 5557 DAP
(discontinued **) Glass fiber-reinforced and inorganically filled diallylphthalate molding compound (DAP) in various colors. Good mechanical strength together with retention of high electrical properties under hot h.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage
(disconti Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed
&n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou.. |
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| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte.. |
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