Category | Polymer , Thermoset , Filled/Reinforced Thermoset , Phenolic |
Manufacturer | |
Trade Name | |
Port | Ningbo port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength.pdf ![]() |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.78 g/cc | 0.0643 lb/in³ | ISO 1183 |
Apparent Bulk Density | 0.730 g/cc | 0.0264 lb/in³ | ISO 60 |
Linear Mold Shrinkage, Flow | -0.000100 cm/cm | -0.000100 in/in | Compression molding; ISO 2577 |
0.0010 cm/cm | 0.0010 in/in | Injection molding; ISO 2577 |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Ball Indentation Hardness | 350 MPa | 50800 psi | H 961/30; ISO 2039/P1 |
Flexural Strength | 125 MPa | 18100 psi | 2 mm/min; ISO 178 |
Flexural Modulus | 13.5 GPa | 1960 ksi | ISO 178 |
Compressive Strength | 200 MPa | 29000 psi | Test specimen flat tested; ISO 604 |
Charpy Impact Unnotched | 0.950 J/cm² @Temperature 23.0 °C |
4.52 ft-lb/in² @Temperature 73.4 °F |
ISO 179-1/2 eU |
Charpy Impact, Notched | 0.300 J/cm² @Temperature 23.0 °C |
1.43 ft-lb/in² @Temperature 73.4 °F |
ISO 179-1/2 eA |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
Maximum Service Temperature, Air | 170 °C | 338 °F | <20000 hours; IEC 60216-P1 |
240 °C | 464 °F | < 50 hours; IEC 60216-P1 | |
Deflection Temperature at 8.0 MPa | 160 °C | 320 °F | ISO 75-2 |
Shrinkage | 0.0500 % @Temperature 110 °C |
0.0500 % @Temperature 230 °F |
Compression molding; ISO 2577 |
0.100 % @Temperature 110 °C, Time 605000 sec |
0.100 % @Temperature 230 °F, Time 168 hour |
Injection molding; ISO 2577 |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | 1.00e+12 ohm-cm | 1.00e+12 ohm-cm | IEC 60093 |
Surface Resistance | 1.00e+11 ohm | 1.00e+11 ohm | IEC 60093 |
Dielectric Constant | 6.0 @Frequency 100 Hz |
6.0 @Frequency 100 Hz |
IEC 60250 |
Dielectric Strength | 30.0 kV/mm @Thickness 1.00 mm |
762 kV/in @Thickness 0.0394 in |
IEC 60243-P1 |
Dissipation Factor | 0.050 @Frequency 100 Hz |
0.050 @Frequency 100 Hz |
IEC 60250 |
Comparative Tracking Index | 175 V | 175 V | Test liquid A; IEC 60112 |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding |
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
160 - 190 °C | 320 - 374 °F | Compression molding | |
Injection Pressure | >= 15.0 MPa | >= 2180 psi | Compression and injection cavity mold pressure |
Back Pressure | 0.500 - 2.00 MPa | 72.5 - 290 psi | Injection molding |
Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding |
0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Descriptive Properties | Value | Comments |
---|---|---|
Chromatic Spectrum | All Colors | |
Creep Rupture Strength | Very Good | |
Holding Pressure | Approximately 40-60% of injection pressure | |
Media Resistance | Very Good | |
Moisture Absorption | 13 mg | ISO 62, 24 hours at 23°C |
Reserves by Peak Temperature | Very High | |
Thermal Expansion | Very Slight |