Polymer Property : Cure Time = 72.0 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1121-4 Adhesive / Casting Resin Resinlab™ EP1121-4 is a highly filled, high viscosity black adhesive / casting resin designed for applications requiring a high degree of thermal conductivity, flexibility, and a low CTE. It gives ..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
NextGen Adhesives G907-27 Structural Adhesive Description: NGAC G907-27 is a medium viscosity polyamide adhesive system utilized extensively in industrial and structural applications.Advantages and Applications: The NGAC G907-27 provides excell..
Cure Time	2880 - 4320 min @Temperature 25.0 °C	48.0 - 72.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MPP-D80B Rigid Polyurethane MPP-D80B has a high load-bearing property at hardness 80 D Durometer. This material has a relatively slow curing pattern. Whereas many polyurethane formulations of this hardness cure very fast thus..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MYP-V40A Polyurethane Filler Gel This polyurethane casting material is developed for applications that require inexpensive liquid resin filler such as encapsulation of a large electric components or puncture-free tire for low-speed..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1294 Mineral Filled, Flame Retardant Epoxy Syntactic Foam Resinlab™ EP1294 is a two part mineral filled, flame retardant epoxy syntactic foam. It utilizes glass microspheres to reduce cured density and improve machinability. This product will be self-exti..
Cure Time	2880 - 4320 min @Temperature 25.0 °C	48.0 - 72.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers GK-22 Polyurethane Gel for Adhesion Pad Applications GK-22 is a polyurethane gel formulation designed to make soft sticky polyurethane gel for pressure-sensitive-adhesive type products. This 2-part cast urethane system can be manually processed easi..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation ..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21AOLV-1 Two Part, Room Temperature Curing Epoxy System Product Description: Master Bond Polymer Adhesive EP21AOLV-1 is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant and coating. This versatile system will adhere t..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21TDC-2ND Two component, highly flexibilized, non-drip epoxy resin compound Product Description: Master Bond EP21TDC-2ND is a two component highly flexible epoxy resin system for high performance bonding, sealing and coating with a non-drip consistency. It has a forgiving o..
Cure Time	2880 - 4320 min @Temperature 23.0 °C	48.0 - 72.0 hour @Temperature 73.4 °F
Master Bond EP37-3FLF Low Exotherm Highly Flexible Two Component Epoxy Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. The ..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP42HT-2Med Epoxy Meets USP Class VI Requirements Description: Master Bond Polymer System EP42HT-2Med is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along wit..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP42HT-2ND-2Med Heat Resistant, Medical Grade Non-Drip Epoxy Master Bond Polymer System EP42HT-2ND2MED (Black) is a room temperature curable two component epoxy adhesive and sealant featuring high temperature resistance along with outstanding chemical resista..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond MasterSil 156 Two Part, Low Viscosity Silicone Description: Master Bond MasterSil 156 is a two component, lower viscosity silicone system for high performance potting, encapsulation and sealing. MasterSil 156 combines high temperature resistance..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21TPFL-1AO Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System Product Description: Master Bond EP21TPFL-1AO is a two component, low viscosity epoxy polysulfide for high performance bonding, sealing, coating and casting offering thermal conductivity, electrical..
Cure Time	2880 - 4320 min @Temperature 23.0 °C	48.0 - 72.0 hour @Temperature 73.4 °F
Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30M3LV is a lower viscosity, two component epoxy system for high performance bonding, sealing and encapsulation. It is formulated to cure at ambient temperatures or mor..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP42-2LV Epoxy Resists Heat and Chemicals Description: Master Bond Polymer System EP42-2LV is a low viscosity room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring outstanding chemical resis..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP42HT-2 Epoxy Adhesive Resists Sterilization Description: Master Bond Polymer System EP42HT-2 is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material featuring high temperature resistance along with o..
Cure Time	1440 - 4320 min @Temperature 23.9 °C	24.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP42HT-2AO-1 Two Part, Cryogenically Serviceable Epoxy Description: Master Bond EP42HT-2AO-1 Black is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material that meets NASA low outgassing specifications. It featu..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond Supreme 33CLV Two Component, Room Temperature Curing Toughened Epoxy Master Bond Polymer System Supreme 33CLV is a special, room temperature curing, toughened epoxy adhesive/sealant, featuring exceptionally high temperature resistance. This innovative system has outs..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond 2143D Medium Viscosity Polyamide Epoxy Adhesive TRA-BOND 2143D is a medium viscosity adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This tw..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1200 Black Casting Resin Resinlab™ EP1200 Black is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility and a low CTE. It meets the re..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1200LV Casting Resin Resinlab™ EP1200LV a low viscosity version of EP1200, a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility an..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1296 Highly Filled, Moderately Thixotropic Black Casting Resin Resinlab™ EP1296 is a highly filled, moderately thixotropic black casting resin designed for applications requiring good thermal conductivity, low shrinkage and a low CTE. It was especially formula..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat..