Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive , Epoxy Encapsulant, Unreinforced
Manufacturer	Master Bond Inc.
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Master Bond Polymer System EP30M3LV is a lower viscosity, two component epoxy system for high performance bonding, sealing and encapsulation. It is formulated to cure at ambient temperatures or more rapidly at elevated temperatures. It has a lower exotherm and a longer working life, which makes it highly desirable for moderate to larger encapsulations. It features superior electrical insulation properties.

Physical Properties	Metric	English	Comments
Viscosity	2000 - 3000 cP @Temperature 23.0 °C	2000 - 3000 cP @Temperature 73.4 °F

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	121 °C	250 °F
Minimum Service Temperature, Air	-51.1 °C	-60.0 °F

Processing Properties	Metric	English	Comments
Cure Time	180 - 240 min @Temperature 93.3 °C	3.00 - 4.00 hour @Temperature 200 °F
	2880 - 4320 min @Temperature 23.0 °C	48.0 - 72.0 hour @Temperature 73.4 °F

Descriptive Properties	Value	Comments
Color Code	"A" Black; "B" Brown
Mix Ratio By Weight	100/50
Set-Up Time, minutes	130-150	At Room Temperature

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