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Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive , Epoxy Encapsulant, Unreinforced
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy.pdf
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Material Notes:
Master Bond Polymer System EP30M3LV is a lower viscosity, two component epoxy system for high performance bonding, sealing and encapsulation. It is formulated to cure at ambient temperatures or more rapidly at elevated temperatures. It has a lower exotherm and a longer working life, which makes it highly desirable for moderate to larger encapsulations. It features superior electrical insulation properties.
Physical Properties Metric English Comments
Viscosity 2000 - 3000 cP

@Temperature 23.0 °C
2000 - 3000 cP

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Processing Properties Metric English Comments
Cure Time 180 - 240 min

@Temperature 93.3 °C
3.00 - 4.00 hour

@Temperature 200 °F
2880 - 4320 min

@Temperature 23.0 °C
48.0 - 72.0 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Black; "B" Brown
Mix Ratio By Weight 100/50
Set-Up Time, minutes 130-150
At Room Temperature
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