Polymer Property : Cure Time = 240 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
NextGen Adhesives G907-24 Structural Epoxy Adhesive Description: NGAC G907-24 is a medium viscosity and near transparent adhesive system that is specifically formulated for structural applications requiring excellent wetting, mechanical strength and ..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co..
Cure Time	240 min @Temperature 22.0 °C	4.00 hour @Temperature 71.6 °F	50% RH, Handling Time
Parker Chomerics ParPHorm® 1800 Non-Conductive Form-in-Place Gasket Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time	240 - 360 min @Temperature 60.0 - 70.0 °C	4.00 - 6.00 hour @Temperature 140 - 158 °F
Master Bond EP62-1Med USP Class VI Two Component Epoxy Resin System Master Bond EP62-1Med is a two component epoxy system that has an exceptionally long working life at ambient temperatures and cures rapidly at moderately elevated temperatures. It has a 100 to 10 mi..
Cure Time	240 - 420 min @Temperature 23.9 °C	4.00 - 7.00 hour @Temperature 75.0 °F
Master Bond Super Gel 9AOND Dimensionally Stable Urethane Modified Epoxy Master Bond Super Gel 9AOND is a two component, urethane modified epoxy system that cures at room temperature and has a paste-like consistency. It offers softness and retains dimensional stability. ..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 5126 Medium Viscosity Aerospace-Grade Epoxy Adhesive TRA-BOND 5126 AEROSPACE-GRADE EPOXY ADHESIVE is a two-part, clear (amber), medium viscosity, aerospace-grade epoxy adhesive system recommended for bonding a wide variety of materials for structural ..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Cast 3103 General Purpose Epoxy Casting Compound TRA-CAST 3103 is a low viscosity two-part formulation recommended for general purpose electrical potting and encapsulating application where the combination of good mechanical thermal and electrical..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Duct 2916T Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2916T is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good el..
Cure Time	240 - 960 min @Temperature 150 °C	4.00 - 16.0 hour @Temperature 302 °F
Trelleborg Emerson & Cuming Eccobond® 11 Heat Cure Catalyst Emerson & Cuming 11 Eccobond® Heat Cure CatalystGeneral purpose, low viscosity, elevated temperature curing. Long working life. Yields cured coatings with excellent chemical resistance. Subject to ..
Cure Time	240 - 360 min @Temperature 25.0 °C	4.00 - 6.00 hour @Temperature 77.0 °F
Tra-Con Tra-Bond 216R01 Fire Retardant Epoxy TRA-BOND 216R01 is a fast curing material with a set time of 5 to 7 minutes. Samples tested were certified to the requirements of UL94 V-O, and is RoHS compliant. TRA-BOND 216R01 develops significa..
Cure Time	240 min @Temperature 75.0 °C	4.00 hour @Temperature 167 °F
Tra-Con Tra-Bond 293-21 General Purpose Epoxy Adhesive TRA-BOND 293-21 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293 s..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Tra-Con Tra-Cast 9182A Semi-Rigid Flame Retardant Epoxy Encapsulant TRA-CAST 9182A is a medium viscosity, flame retardant epoxy encapsulant. It adheres well to most electronic and aerospace-industry materials like metals, glass, ceramic, industrial laminates and rig..
Cure Time	240 min @Temperature 22.0 °C	4.00 hour @Temperature 71.6 °F
Dow Corning SE 4447 CV KIT Two-part liquid silicone elastomer designed for applications requiring very high thermal conductivity and electrical insulation.Information provided by Dow Corning
Cure Time	240 min @Temperature 21.0 °C	4.00 hour @Temperature 69.8 °F	Overcoat End
Chesterton ARC S7 High Temperature & Chemical Resistant Novolac Vinyl Ester Coating Description: ARC S7 is a low VOC, epoxy novolac vinyl ester based coating intended for high temperature exposures in chemically aggressive applications where the risk for thermal cycling may be pres..
Cure Time	240 min @Temperature 16.0 °C	4.00 hour @Temperature 60.8 °F	Tack Free
Chesterton ARC SD4i High temperature ceramic reinforced erosion resistant coating Description: An advanced ceramic composite for resurfacing and protection of metal surfaces in immersion service. It is normally applied in a thickness range of 250-370 microns (10-15 mils) per coat..
Cure Time	240 min @Temperature 100 °C	4.00 hour @Temperature 212 °F
Cytec EN-2521 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Cure Time	240 min @Temperature 100 °C	4.00 hour @Temperature 212 °F
Cytec EN-2541 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Cure Time	240 - 360 min @Temperature 100 °C	4.00 - 6.00 hour @Temperature 212 °F
Cytec EN-2550 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Cure Time	240 min @Temperature 10.0 °C	4.00 hour @Temperature 50.0 °F	Full Load
Chesterton ARC MX5 Rapid Curing Fine Particle Wear Compound Description: An advanced ceramic reinforced composite for the emergency repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a th..
Cure Time	240 - 360 min @Temperature 65.0 °C	4.00 - 6.00 hour @Temperature 149 °F
Atom Adhesives AA-BOND 428 Epoxy Adhesive AA-BOND 428 is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. AA-BOND 428 contains ..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Atom Adhesives AA-BOND FS227 Epoxy Adhesive AA-BOND FS227 is a thixotropic polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting, toughness, a..
Cure Time	240 min @Temperature 65.0 °C	4.00 hour @Temperature 149 °F
Atom Adhesives AA-DUCT 2919 Epoxy Adhesive AA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require good flexibility coupled w..
Cure Time	240 min @Temperature 227 °C	4.00 hour @Temperature 440 °F	Recommended Post Cure Cycle
Arlon 30850S125 0.125" Uncured, Unsupported Silicone Rubber on a Kodacel Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should..
Cure Time	240 min @Temperature 227 °C	4.00 hour @Temperature 440 °F	Recommended Postcure Cycle
Arlon R34020W062 0.062" (1.57 mm) Uncured, Unsupported Silicone Rubber on a Kodacel Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone Rubber on a Kodacel Carrier This data Represents typical values for the production material. The data should not be used to write, or in pla..
Cure Time	240 min @Temperature 79.4 °C	4.00 hour @Temperature 175 °F	>2 Hour Air Set Required Prior to Curing
Aremco Corr-Paint™ CP2050-XX High Temperature Protective Coating Epoxy-Phenolic, Glass Fiber Filled This epoxy and urethane based coating is used for producing corrosion and wear resistant barriers to 500 °F. Typical applications include tanks, pipelines, boilers, precipitators, scrubbers, bag ho..
Cure Time	240 min @Temperature 22.0 °C	4.00 hour @Temperature 71.6 °F	50% RH; Handling Time
Parker Chomerics CHO-FORM 5528 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time	240 min @Temperature 22.0 °C	4.00 hour @Temperature 71.6 °F	50% RH; Handling Time
Parker Chomerics CHO-FORM 5538 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Cure Time	240 min @Temperature 10.0 °C	4.00 hour @Temperature 50.0 °F	Foot Traffic
Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th..
Cure Time	240 min @Temperature 16.0 °C	4.00 hour @Temperature 60.8 °F	Full Load
Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th..