Processing Properties | Metric | English | Comments |
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Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
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NextGen Adhesives G907-24 Structural Epoxy Adhesive Description: NGAC G907-24 is a medium viscosity and near transparent adhesive system that is specifically formulated for structural applications requiring excellent wetting, mechanical strength and .. |
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Cure Time | 240 min @Temperature 79.0 °C |
4.00 hour @Temperature 174 °F |
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Parker Chomerics CHO-SHIELD® 610 A/B Epoxy Conductive Coating Description: CHO-SHIELD® 610 A/B is a highly conductive, two-component silver-plated-copper filled epoxy coating for application to non-conductive plastic substrates, particularly those subject to .. |
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Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
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Resin Technology Group 408 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
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NextGen Adhesives G907-21 Structural Epoxy Adhesive Description: NGAC G907-21 is a high viscosity and thixotropic adhesive system that is specifically formulated for structural bonding applications: industrial, electronics and aerospace.Advantages an.. |
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Cure Time | 240 min @Temperature 80.0 - 85.0 °C |
4.00 hour @Temperature 176 - 185 °F |
plus 2 hours @ 115-125ºC, plus 2 hours @ 145-155ºC |
Lord Adhesives Thermosetâ„¢ EP-809 Ignition Coil Impregnating and Encapsulation Epoxy Lord EP-809 is a long working life, heat curing, two component epoxy formulation. It was designed especially for potting high voltage automotive ignition coils. The combination of low viscosity, exc.. |
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Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
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Tra-Con Tra-Bond 2116 Low Vapor Pressure Epoxy Staking Compound TRA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronic, aerospace, and industrial applications where.. |
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Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
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Tra-Con Tra-Bond 2123 Metal Repair Steel/Epoxy Adhesive TRA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. This .. |
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Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
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Tra-Con Tra-Bond 2135D High Impact Epoxy Adhesive TRA-BOND 2135D is a medium viscosity epoxy adhesive recommended for bonding, laminating, sealing, and structural repair applications where easy mixing and good wetting combined with high impact stre.. |
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Cure Time | 240 min @Temperature 75.0 °C |
4.00 hour @Temperature 167 °F |
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Tra-Con Tra-Bond 286-5 Latex Emulsion TRA-BOND 286-5 latex emulsion is designed for temporary sealing of molds to prevent leaking during cure. This compound will thicken gradually due to water evaporation. Store containers with caps sec.. |
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Cure Time | 240 min @Temperature 75.0 °C |
4.00 hour @Temperature 167 °F |
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Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se.. |
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Cure Time | 240 min @Temperature 75.0 °C |
4.00 hour @Temperature 167 °F |
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Tra-Con Tra-Bond 342-1 Room Temperature Cure Epoxy Adhesive TRA-BOND 342-1 room temperature curing epoxy adhesive is designed for applications which require outstanding thermal shock properties. This adhesive may be used to bond semi-porous materials, such a.. |
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Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
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Tra-Con Tra-Bond 2104 Rigid Epoxy Staking Compound TRA-BOND 2104 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s.. |
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Cure Time | 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
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Tra-Con Tra-Bond 216E02 Encapsulant for "Fill" Applications TRA-BOND 216E02 is a two-part epoxy adhesive developed specifically for underfill and encapsulating applications where the combination of excellent mechanical, thermal and electrical properties are .. |
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Cure Time | 240 min @Temperature 75.0 °C |
4.00 hour @Temperature 167 °F |
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Tra-Con Tra-Bond 293-1T General Purpose Instrument Epoxy Adhesive-Thixotropic TRA-BOND 293-1T general purpose epoxy adhesive is designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This ver.. |
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Cure Time | 240 min @Temperature 25.0 °C |
4.00 hour @Temperature 77.0 °F |
Light Load |
Chesterton ARC 988 Composite Description: A high performance, quartz reinforced composite designed to resurface and restore concrete surfaces, to protect new concrete, and to repair concrete damaged by severe chemical and physi.. |
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Cure Time | 240 min @Temperature 25.0 °C |
4.00 hour @Temperature 77.0 °F |
Overcoat Begin |
Chesterton ARC HT-T Spark Testable High Temperature Trowelable Abrasion Control Compound An advanced ceramic composite formulated to protect equipment from corrosion and erosion in elevated temperature water solution immersion. This system is a high viscosity composite that is applied b.. |
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Cure Time | 240 min @Temperature 25.0 °C |
4.00 hour @Temperature 77.0 °F |
Tack Free |
Chesterton ARC MXHT High temperature severe wear compound Description: An advanced ceramic composite for the protection of all metal surfaces subjected to severe erosion, abrasion and chemical attack at elevated temperatures. It is applied at a thickness o.. |
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Cure Time | 240 min @Temperature 85.0 °C |
4.00 hour @Temperature 185 °F |
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Cytec Conathane® CE-1175 (Conap) Polyurethane Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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Cure Time | 240 min @Temperature 227 °C |
4.00 hour @Temperature 440 °F |
Recommended Postcure Cycle |
Arlon 30400N125 0.125" (3.17 mm) Uncured, Unsupported Silicone Rubber on a Kodacel Carrier Design/Construction:Side 1: Uncured Unsupported Silicone Rubber on a Kodacel Carrier Appearance: Translucent silicone rubber on polymer linerThis data represents typical values for the production ma.. |
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Cure Time | 240 min @Temperature 204 °C |
4.00 hour @Temperature 400 °F |
Recommended Post Cure Cycle - After 30 minute ramp up cycle |
Arlon 30400R040 0.04" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
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Cure Time | 240 min @Temperature 227 °C |
4.00 hour @Temperature 440 °F |
Recommended Postcure Cycle, after 30 minute ramp up cycle |
Arlon 32400R060 0.060" (1.52 mm) Uncured Silicone Rubber on PET Carrier Design/Construction:Side 1: Uncured Silicone RubberCarrier: PETInterleave: PolyethyleneAppearance: Red silicone rubber on polymer linerThis data represents typical values for the production material.. |
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Cure Time | 240 min @Temperature 175 °C |
4.00 hour @Temperature 347 °F |
Alternate Cure |
Aremco Aremco-Bond™ 2200 High Performance Epoxide Glass Fiber- and Kevlar-Reinforced, Epoxy-Novolac; High Strength, Excellent Abrasion and Corrosion Resistance |
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Cure Time | 240 min @Temperature 32.0 °C |
4.00 hour @Temperature 89.6 °F |
Open Time, 90% RH |
3M 5200 Marine Adhesive/Sealant 3M™ Marine Adhesive/Sealant 5200 is a one-part polyurethane that chemically reacts with moisture to deliver strong, flexible bonds. It has excellent adhesion to wood, gelcoat and fiberglass. It for.. |
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Cure Time | 240 min @Temperature 227 °C |
4.00 hour @Temperature 440 °F |
Recommended Postcure Cycle |
Arlon R34020W062 0.062" (1.57 mm) Uncured, Unsupported Silicone Rubber on a Kodacel Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone Rubber on a Kodacel Carrier This data Represents typical values for the production material. The data should not be used to write, or in pla.. |
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Cure Time | 240 min @Temperature 22.0 °C |
4.00 hour @Temperature 71.6 °F |
50% RH; Handling Time |
Parker Chomerics CHO-FORM 5538 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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Cure Time | 240 min @Temperature 16.0 °C |
4.00 hour @Temperature 60.8 °F |
Full Load |
Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th.. |
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Cure Time | 240 min @Temperature 227 °C |
4.00 hour @Temperature 440 °F |
Recommended Post Cure Cycle |
Arlon 30850N125 0.125" Uncured, Unsupported Silicone Rubber on a Kodacel Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |
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Cure Time | 240 min @Temperature 227 °C |
4.00 hour @Temperature 440 °F |
Recommended Post Cure Cycle |
Arlon 30850S085 0.085" Uncured, Unsupported Silicone Rubber on Release Carrier Design/Construction:Side 1: Uncured, Unsupported Silicone RubberSubstrate: Kodacel CarrierInterleave: 0.003" PolyethyleneThis data represents typical values for the production material and should.. |