Tra-Con Tra-Bond 216E02 Encapsulant for "Fill" Applications

TRA-BOND 216E02 is a two-part epoxy adhesive developed specifically for underfill and encapsulating applications where the combination of excellent mechanical, thermal and electrical properties are required. TRA-BOND 216E02 works in concert with 216E01 to perform `dam` and `fill` functions. TRA-BOND 216E02 exhibits superior adhesion to glass, ceramics, metals, plastics and other electronic materials. Fully cured TRA-BOND 216E02 is an excellent electrical insulator and provides resistance to water, gases and vapors, acids, alkalis, salt solutions, petroleum products and other organic and inorganic compounds. Information provided by Tra-Con Inc.