| Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive , Epoxy, Electrically Conductive |
| Manufacturer | Resin Technology Group |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Resin Technology Group 408 Oxy-Bond™ Electrically Conductive Epoxy Adhesive.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Maximum Service Temperature, Air | 135 °C | 275 °F | |
| Minimum Service Temperature, Air | -60.0 °C | -76.0 °F |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 3.00 min @Temperature 150 °C |
0.0500 hour @Temperature 302 °F |
|
| 240 min @Temperature 65.0 °C |
4.00 hour @Temperature 149 °F |
||
| Pot Life | 240 min | 240 min | |
| 240 min | 240 min |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Viscosity | Smooth Paste |