Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Tra-Con Tra-Bond 2116 Low Vapor Pressure Epoxy Staking Compound

Category Polymer , Adhesive , Thermoset , Epoxy , Filled/Reinforced Thermoset
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond 2116 Low Vapor Pressure Epoxy Staking Compound.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
TRA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronic, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies. This two-part, solvent-free compound is readily mixed, handled, used, and cured at room temperature, and develops strong bonds to most clean, dry material surfaces including metals, glass, ceramics, wood and many plastics. Fully cured TRA-BOND 2116 bonds provide electrical insulation and excellent resistance to weather, galvanic action, petroleum solvents and lubricants, gasoline, jet fuels, alcohol, salts, and mild acids and alkalis. Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 1.26 g/cc
1.26 g/cc
Mixed
Solids Content 100 %
100 %
Reactive Solids Content
Viscosity 100000 cP

@Temperature 25.0 °C
100000 cP

@Temperature 77.0 °F
After mixing
Mechanical Properties Metric English Comments
Hardness, Shore D 90
90
Adhesive Bond Strength 17.2 MPa
2500 psi
Lap shear, alum to alum, 1 hr @ 65°C
Izod Impact, Notched 0.117 J/cm
0.220 ft-lb/in
Thermal Properties Metric English Comments
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Maximum Service Temperature, Air 130 °C
266 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Glass Transition Temp, Tg 115 °C
239 °F
Ultimate Tg
Electrical Properties Metric English Comments
Volume Resistivity 6.00e+13 ohm-cm
6.00e+13 ohm-cm
1.00e+10 ohm-cm

@Temperature 100 °C
1.00e+10 ohm-cm

@Temperature 212 °F
Dielectric Constant 4.5

@Frequency 1000 Hz
4.5

@Frequency 1000 Hz
Dielectric Strength 16.3 kV/mm
415 kV/in
Dissipation Factor 0.010

@Frequency 1000 Hz
0.010

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 240 min

@Temperature 65.0 °C
4.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 30 min
30 min
Descriptive Properties Value Comments
Color Milky, Translucent
Mix Ratio, parts by weight 100/22
Resin/Hardener
Outgassing, NASA Passes
Copyright © lookpolymers.com All Rights Reserved