Polymer Property : Pot Life = 1440 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	1440 min	1440 min
NextGen Adhesives P907-30 Optical Assembly Adhesive Description: NGAC P907-30 is a high viscosity, controlled flow encapsulant designed for microelectronics applications requiring low shrinkage and high reliability performance.Advantages and Applicat..
Pot Life	1440 min	1440 min
Resin Technology Group 405 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life	1440 - 2880 min @Temperature 25.0 Â°C	1440 - 2880 min @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ EP-809 Ignition Coil Impregnating and Encapsulation Epoxy Lord EP-809 is a long working life, heat curing, two component epoxy formulation. It was designed especially for potting high voltage automotive ignition coils. The combination of low viscosity, exc..
Pot Life	1440 - 2880 min @Temperature 25.0 Â°C	1440 - 2880 min @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ EP-830 Ignition Coil Impregnating and Encapsulation Epoxy Lord EP-830 is a heat curing, two component epoxy formulation designed especially for use in automotive high voltage ignition coils where adhesion to segmented bobbins is critical. The combination o..
Pot Life	>= 1440 min	>= 1440 min	100 gram batch
Master Bond EP46HT-1 Epoxy For Serviceability Up To 600°F Description: Master Bond EP46HT-1 is a two component epoxy system for high performance structural bonding and sealing suitable for applications where resistance to temperatures from -100°F to +550°..
Pot Life	>= 1440 min	>= 1440 min	100 gram batch
Master Bond Ep46HT-2 Two Component, Heat Resistant Epoxy System Master Bond Polymer System EP46HT-2 is a two component epoxy system for bonding, sealing and casting applications where resistance to temperatures from -100°F to +500°F is required. It is 100% rea..
Pot Life	>= 1440 min	>= 1440 min	100 gram batch
Master Bond EP46HT-2Med Two Component Heat Resistant Biocompatible Epoxy System Master Bond Polymer System EP46HT-2MED is a two component medical grade epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures fr..
Pot Life	1440 min	1440 min	(1 day)
Tra-Con Tra-Bond 2212 High Temperature Epoxy Adhesive TRA-BOND 2212 was developed for high temperature bonding, laminating, filament winding and potting applications where the combination of good physical and mechanical properties plus superior wetting..
Pot Life	1440 min @Temperature 25.0 °C	1440 min @Temperature 77.0 °F	(1 day), 0.6 grams
Tra-Con Tra-Bond 526W01 Microelectronics Grade Encapsulant TRA-BOND 526W01 is a one component micro-electronics grade controlled flow encapsulant designed to protect wire bonds and bare die. TRA-BOND 526W01 has a low coefficient of thermal expansion and low..
Pot Life	1440 min	1440 min	(1 day)
Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part f..
Pot Life	1440 min	1440 min
Dow Corning HM-2510 CLEAR ASSEMBLY SEALANT A reactive Hot Melt silicone sealant that has immediate strength and crosslinks into a neutral cure RTV sealantInformation provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® 9280/30 KIT PARTS A&B 40 Durometer, 2-part, 1 to 1 mix, translucent Liquid Silicone Rubber.Information provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® 94-599-HC SILICONE RUBBER PART A&B 47 Durometer, 2-part, 1 to 1 mix, translucent, molding grade, Liquid Silicone Rubber.Information provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® LSR 9682-50 PARTS A&B 50 Durometer, 2-part, 1 to 1 mix, clear Liquid Silicone RubberInformation provided by Dow Corning
Pot Life	1440 min	1440 min
Dow Corning SILASTIC® LSR 9791-70 A&B KIT 70 Durometer, 2-part, 1 to 1 mix, translucent, molding grade, Liquid Silicone Rubber.Information provided by Dow Corning
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® 323LP Epoxy Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.Information Provided by Epoxy Technology
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® 337H Graphite-Filled, High Temperature Epoxy Product Description: EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic ind..
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® 377 High Temperature Epoxy Product Description: EPO TEK®377 is a two component, high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor, medical and optical applications.Advantages & Application Notes:..
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl..
Pot Life	1440 min	1440 min
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N..
Pot Life	1440 min @Temperature 23.0 °C	1440 min @Temperature 73.4 °F
Loctite® 3889 Rapid Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..