Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive , Filled/Reinforced Thermoset
Manufacturer	Tra-Con, Inc.
Trade Name	Tra-Duct
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part formulation is free of solvents. TRA-DUCT 29121 can be screen printed, machine dispensed or stamped. Information provided by Tra-Con Inc.

Physical Properties	Metric	English	Comments
Specific Gravity	3.00 g/cc	3.00 g/cc	Mixed, degassed
Viscosity	44500 cP @Temperature 25.0 °C	44500 cP @Temperature 77.0 °F	After mixing

Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	7.65 MPa	1110 psi	Lap shear, alum to alum

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	125 °C	257 °F
Minimum Service Temperature, Air	-60.0 °C	-76.0 °F
Glass Transition Temp, Tg	62.0 °C	144 °F	Ultimate Tg

Processing Properties	Metric	English	Comments
Cure Time	0.750 min @Temperature 175 °C	0.0125 hour @Temperature 347 °F
	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F
	15.0 min @Temperature 120 °C	0.250 hour @Temperature 248 °F
	90.0 min @Temperature 80.0 °C	1.50 hour @Temperature 176 °F
	720 min @Temperature 50.0 °C	12.0 hour @Temperature 122 °F
Pot Life	1440 min	1440 min	(1 day)

Descriptive Properties	Value	Comments
Color	Silver
Mix Ratio, parts by weight	100/100	Resin/Hardener
Thixotropic Index	3.2	1 rpm/10 rpm, cp #52
Working Life hours	48

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