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Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Application Notes:•This product is the two component version of EPO-TEK® E3001. The two component version can offer advantages such as: lower cost, room temperature shipment instead of pre-mixed and frozen dry ice shipments, and maximum pot-life observed at site.Versatility & Cure: snap cures of 90 seconds, fast cures of 15 minutes and traditional oven cures of 1-3 hours can be realized.Designed for JEDEC Level III and II packaging criteria. Compatible with die sizes up to 250 mil x 250 mil. Also recommended for small die such as LEDs and GaAs devices like 10 mil x 10 mil.Beneficial radius of curvature after die-attach cure.Compatible with high volume, automated syringe dispensing manufacturing processes.Suggested applications:Semiconductor: die attach onto lead-frames such as Ag spot die paddle, COB, advanced packages, and hybrid circuits. Hybrid Microelectronics: die attach bonding onto ceramic PCB, as well as attaching SMDs onto the same substrate.Opto-electronics: Die attach of LEDs, LED arrays, LED on PCB, or packaged onto lead-frames. Die attach epoxy for near-IR chips used in IRDA (Infra Red Data Acquisition).Die-attach bonding of laser diode or photo-diode for fiber optics packaging.Many modifications are available, including lower temperature cure, lower stress, longer pot-life, and higher thixotropic index. Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.04 g/cc
1.04 g/cc
Part B
2.78 g/cc
2.78 g/cc
Part A
Viscosity 2000 - 4100 cP

@Temperature 23.0 °C
2000 - 4100 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 78
78
Tensile Modulus 2.59 GPa
375 ksi
Storage
Shear Strength 9.591 MPa
1391 psi
Lap
>= 11.7 MPa
>= 1700 psi
Die
Thermal Properties Metric English Comments
CTE, linear 50.0 µm/m-°C
27.8 µin/in-°F
Below Tg
124 µm/m-°C
68.9 µin/in-°F
Above Tg
Thermal Conductivity 0.930 W/m-K
6.45 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 90.0 °C
>= 194 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 428 °C
802 °F
Degradation Temperature; TGA
Electrical Properties Metric English Comments
Volume Resistivity >= 0.00050 ohm-cm
>= 0.00050 ohm-cm
>= 0.00070 ohm-cm
>= 0.00070 ohm-cm
200°C/2 min
Chemical Properties Metric English Comments
Ionic Impurities - Cl (Chloride) 45 ppm
45 ppm
Processing Properties Metric English Comments
Cure Time 0.750 min

@Temperature 170 °C
0.0125 hour

@Temperature 338 °F
Bond Line
5.00 min

@Temperature 160 °C
0.0833 hour

@Temperature 320 °F
Bond Line
15.0 min

@Temperature 150 °C
0.250 hour

@Temperature 302 °F
Bond Line
Pot Life 1440 min
1440 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Amber
Part B
Silver
Part A
Consistency Smooth Thixotropic Paste
Mix Ratio By Weight 100:3
Number of Components Two
Weight Loss 0.04%
200°C
0.22%
300°C
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