- HOME
- POLYMER SEARCH
- Thermoset
- Tra-Con Tra-Bond 526W01 Microelectronics Grade Encapsulant
Tra-Con Tra-Bond 526W01 Microelectronics Grade Encapsulant
| Category | Polymer , Thermoset |
| Manufacturer | Tra-Con, Inc. |
| Trade Name | Tra-Bond |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Tra-Con Tra-Bond 526W01 Microelectronics Grade Encapsulant.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
TRA-BOND 526W01 is a one component micro-electronics grade controlled flow encapsulant designed to protect wire bonds and bare die. TRA-BOND 526W01 has a low coefficient of thermal expansion and low shrinkage upon cure providing low stress. TRA-BOND 526W01 is a humidity resistant encapsulant capable of withstanding multiple reflow exposures to 260°C. Information provided by Tra-Con Inc.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.80 g/cc | 1.80 g/cc | Cured |
| Viscosity | 300000 cP @Temperature 25.0 °C |
300000 cP @Temperature 77.0 °F |
Mixed (cp #52, 1 rpm) |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 92 | 92 | |
| Adhesive Bond Strength | 5.52 MPa | 800 psi | Lap shear, gold to gold, 45 min @ 150°C |
| 6.21 MPa | 900 psi | Lap shear, alum to alum, 45 min @ 150°C |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 19.0 µm/m-°C @Temperature -40.0 - 100 °C |
10.6 µin/in-°F @Temperature -40.0 - 212 °F |
Alpha 1; TMA |
| 68.0 µm/m-°C @Temperature 150 - 220 °C |
37.8 µin/in-°F @Temperature 302 - 428 °F |
Alpha 2; TMA | |
| Maximum Service Temperature, Air | 260 °C | 500 °F | |
| Minimum Service Temperature, Air | -50.0 °C | -58.0 °F | |
| Glass Transition Temp, Tg | 130 °C | 266 °F | Ultimate Tg; TMA |
| Chemical Properties | Metric | English | Comments |
|---|---|---|---|
| Ionic Impurities - Na (Sodium) | <= 10 ppm | <= 10 ppm | |
| Ionic Impurities - K (Potassium) | <= 10 ppm | <= 10 ppm | |
| Ionic Impurities - Cl (Chloride) | <= 25 ppm | <= 25 ppm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 75.0 min | 1.25 hour | 30 min @ 100-120°C + 45 min @ 150°C |
| 45.0 min @Temperature 150 °C |
0.750 hour @Temperature 302 °F |
||
| Pot Life | 1440 min @Temperature 25.0 °C |
1440 min @Temperature 77.0 °F |
(1 day), 0.6 grams |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Black | |
| Flow, mm | 15.5 | 0.6 grams @ 120°C |
| Ionic Impurities - Ammonium | <10 ppm | |
| Ionic Impurities - Bromide | <10 ppm | |
| Ionic Impurities - Fluoride | <10 ppm | |
| Ionic Impurities - Magnesium | <10 ppm | |
| Ionic Impurities - Phosphate | <10 ppm | |
| Ionic Impurities - Sulfate | <10 ppm |
Users viewing this material also viewed the following:
- Multibase Multi-Flex® TPE A 6221 M BLK
- PolyOne Geon™ Vinyl Wire & Cable WY66AL Polyvinyl Chloride, Flexible (PVC, Flexible)
- SABIC Innovative Plastics Cycoloy® CX7240 PC+ABS (Asia Pacific)
- SABIC Innovative Plastics LNP Stat-kon ZE0039 MODIFIED POYPHENYLENE
- W. L. Gore GORE™ 800 PTFE Universal Pipe Gasket (Style 800)
- Wico Plast Wicotal 90 Acetal
- Tra-Con Tra-Cast 3104 Low Viscosity Epoxy Casting Compound
- Covestro Desmopan® 392 Thermoplastic Polyurethane
- Esstech X-863-0050 Surface Active Monomer, NTG-GMA, Sodium Salt, C16H20NO5Na
- Asahi Kasei Leona® 13G25 25% Glass Filled Nylon 66
Copyright © lookpolymers.com All Rights Reserved