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Epoxy Technology EPO-TEK® 377 High Temperature Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, High Temperature
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® 377 High Temperature Epoxy.pdf
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Material Notes:
Product Description: EPO TEK®377 is a two component, high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor, medical and optical applications.Advantages & Application Notes: Low viscosity epoxy with excellent handling characteristics. It can be used for encapsulating or potting. It may be applied by hand, pouring, spin coating, brushing, dipping, or automated dispensers.Complies with USP Class VI biocompatibility standards.Passes NASA low outgassing standard ASTM E595 with proper cureSuggested Medical Applications / Scientific OEM:Potting fiber ferrules for endoscopesOutstanding high temperature properties at 300°C and excellent solvent, chemical and moisture resistance, including autoclave, ETO, and gamma radiationSuggested Semiconductor Grade epoxySpin coating at wafer level for MEMS fabrication of pressure sensors and accelerometersWafer-to-wafer bonding in CSPCapillary underfill of flip chip packaged dieSuggested Optical grade epoxy, opto-electronic packagingTransmission in NIR from 700 – 900 nm >95%Glass seal, hermetic seal of glass plates in LCD fabricationHermetic seal of IR-filter window to aluminum cap of TO-Can in hybrid packaged IR sensors.Suggested Industrial: resist salt water, hydraulic fluids, motor oil, alcohol, 10% nitric acid, 10% sulfuric acid, 10% ammonia solution and most solvents.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.15 g/cc
1.15 g/cc
Part A
1.22 g/cc
1.22 g/cc
Part B
Viscosity 150 - 300 cP

@Temperature 23.0 °C
150 - 300 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 67
67
Tensile Modulus 2.58 GPa
374 ksi
Storage
Shear Strength 10.04 MPa
1456 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 57.0 µm/m-°C
31.7 µin/in-°F
Below Tg
210 µm/m-°C
117 µin/in-°F
Above Tg
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 95.0 °C
>= 203 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 375 °C
707 °F
Degradation Temperature
Optical Properties Metric English Comments
Refractive Index 1.5195

@Wavelength 589 nm
1.5195

@Wavelength 589 nm
Transmission, Visible >= 95 %

@Wavelength 1000 - 1500 nm
>= 95 %

@Wavelength 1000 - 1500 nm
Spectral
>= 99 %

@Wavelength 600 nm
>= 99 %

@Wavelength 600 nm
Spectral
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+13 ohm-cm
>= 1.00e+13 ohm-cm
Dielectric Constant 3.36

@Frequency 1000 Hz
3.36

@Frequency 1000 Hz
Dissipation Factor 0.0050

@Frequency 1000 Hz
0.0050

@Frequency 1000 Hz
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 15 ppm
15 ppm
Ionic Impurities - K (Potassium) 3.0 ppm
3.0 ppm
Ionic Impurities - Cl (Chloride) 26 ppm
26 ppm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Minimum Bond Line
Pot Life 1440 min
1440 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Amber
Part B
Clear/Colorless
Part A
Consistency Pourable liquid
Ionic Impurities NH4 22 ppm
Mix Ratio By Weight 1:1
Number of Components Two
Weight Loss 0.06%
200°C
0.17%
250°C
0.5%
300°C
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