Processing Properties | Metric | English | Comments |
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Pot Life | 240 min | 240 min | |
Resin Technology Group 408 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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Pot Life | 240 min | 240 min | |
Resin Technology Group 408 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive 100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol.. |
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Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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Momentive Performance Materials RTV656 Clear Extreme Low Temperature Potting/Encapsulating Compound Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth.. |
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Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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Tra-Con Tra-Bond 221M02 Information provided by Tra-Con Inc. |
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Pot Life | 240 min | 240 min | |
Tra-Con Tra-Bond F123 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123 is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating sin.. |
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Pot Life | 240 min | 240 min | |
Tra-Con Tra-Bond F123LV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123LV is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s.. |
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Pot Life | 240 min | 240 min | |
Tra-Con Tra-Cast FS407 Low Viscosity High Temperature Epoxy Casting System TRA-CAST FS407 is a low viscosity, solvent-free epoxy casting system recommended for rigid industrial laminating, electrical potting and transformer or coil embedding applications that require the e.. |
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Pot Life | 240 min | 240 min | |
Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications .. |
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Pot Life | >= 240 min @Temperature 25.0 °C |
>= 240 min @Temperature 77.0 °F |
100 grams |
Trelleborg Emerson & Cuming Eccobond® 11 Heat Cure Catalyst Emerson & Cuming 11 Eccobond® Heat Cure CatalystGeneral purpose, low viscosity, elevated temperature curing. Long working life. Yields cured coatings with excellent chemical resistance. Subject to .. |
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Pot Life | 240 min | 240 min | |
Tra-Con Tra-Bond 526M03 Fast Cure Epoxy Adhesive TRA-BOND 526M03 is a fast cure, high viscosity, two-component epoxy formulation. It develops strong, tough, mechanically stable bonds to a wide variety of fiber optic and optical materials that incl.. |
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Pot Life | 240 - 360 min @Temperature 25.0 °C |
240 - 360 min @Temperature 77.0 °F |
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Cytec Conathane® CC-1195 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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Pot Life | 240 min | 240 min | |
Epoxy Technology EPO-TEK® 360T High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic.. |
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Pot Life | 240 min | 240 min | |
Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other.. |
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Pot Life | 240 min | 240 min | |
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe.. |
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Pot Life | 240 min | 240 min | |
Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid.. |
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Pot Life | 240 min | 240 min | |
Epoxy Technology EPO-TEK® OE101 Two Component Epoxy Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf.. |
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Pot Life | 240 min | 240 min | |
Epoxyset Epoxiohm EO-30M-1 Electrically Conductive Epoxy Adhesive EO-30M-1 is a two part, semi-rigid, silver filled, epoxy adhesive. EO-30M-1 exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.Information.. |
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Pot Life | 240 min @Temperature 75.0 °C |
240 min @Temperature 167 °F |
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ACC EP WQS EPI Engineered Polymers Water Base Quick Set Epoxy EP WQS Water Base Quick Set, “Powered by Reactamine® Technology”, is a two component 60% solids, no VOC, self-leveling modified epoxy. This versatile new generation epoxy displays low blush, fast.. |
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Pot Life | 240 min @Temperature 24.0 °C |
240 min @Temperature 75.2 °F |
15 lb. mass |
BCC Products BC 7009-2 Epoxy Casting BC 7009-2 is an iron filled, low-cost mass casting system. Recommended for use in casting a minimum of two inches and a maximum of six inches in non-conductive molds. Thicknesses to nine inches in m.. |
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Pot Life | >= 240 min @Temperature 23.0 °C |
>= 240 min @Temperature 73.4 °F |
100 g mass |
Aremco Aremco-Bond™ 2340 High Temperature Epoxide Potting Compound High Temperature, Low Viscosity, Low Expansion, High Glass Transition Temperature & Chemical Resistance |
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Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
100 gm mass |
Aremco Aremco-Bond™ 568 High Performance Epoxide Aluminum-Filled, 1:1, Good Bond Strength and High Thermal Conductivity. |
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Pot Life | 240 min | 240 min | uncured |
Atom Adhesives AA-BOND F123 Epoxy Adhesive AA-BOND F123 is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi.. |
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Pot Life | 240 min | 240 min | 500 g |
Abatron AboCast 50-11/AboCure 50-1 Epoxy Information provided by Abatron, Inc.Processing: Shelf life: 12+ months (unmixed). 100/35 ratio. Pot life: 500 g, 240 min. at 25°C(77°F). Exothermic Peak 190°C (375°F). Hardens in 2-24 hours.. |
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Pot Life | 240 min | 240 min | 100 g |
Abatron AboCast 7802-1/AboCure 50-3 (80 pbw) Epoxy AboCast 7802-1 is a clear resin with low viscosity (600-800 cps.) and a weight of 9.1 lbs/gallon. AboCure 50-3 is a clear, slow converter for lower rigidity. It has an HDT of 60°C, variable ratio, .. |
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Pot Life | 240 min | 240 min | 100 g |
Abatron AboCast 7802-1/AboCure 7804-3 (40 pbw) Epoxy AboCast 7802-1 is a clear resin with low viscosity (600-800 cps.) and a weight of 9.1 lbs/gallon. AboCure 7804-3 a clear, slightly accelerated converter for lower rigidity. It has an HDT of 60°C, v.. |
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Pot Life | 240 min | 240 min | |
Aremco Aremco-Bond™ 598 Conductive Epoxy Adhesive
(discontinued **) Electrically and thermally conductive, nickel-filled, single part system. Low viscosity, inorganic coating for applications to 1000 ºF (540 °C). |
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Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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Momentive Performance Materials RTV630 Blue General Purpose Potting/Encapsulating Compound Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth.. |