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Polymer Property : Pot Life = 240 min Product List

Processing Properties

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Processing Properties Metric English Comments
Pot Life 240 min
240 min
Resin Technology Group 408 Oxy-Bond™ Electrically Conductive Epoxy Adhesive
Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life 240 min
240 min
Resin Technology Group 408 Oxy-Bond™ Electrically Conductive Epoxy Adhesive
Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life 240 min

@Temperature 25.0 °C
240 min

@Temperature 77.0 °F
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive
100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol..
Pot Life 240 min

@Temperature 25.0 °C
240 min

@Temperature 77.0 °F
Momentive Performance Materials RTV656 Clear Extreme Low Temperature Potting/Encapsulating Compound
Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth..
Pot Life 240 min

@Temperature 25.0 °C
240 min

@Temperature 77.0 °F
Tra-Con Tra-Bond 221M02
Information provided by Tra-Con Inc.
Pot Life 240 min
240 min
Tra-Con Tra-Bond F123 Color Keyed High Temperature Epoxy Adhesive
TRA-BOND F123 is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating sin..
Pot Life 240 min
240 min
Tra-Con Tra-Bond F123LV Color Keyed High Temperature Epoxy Adhesive
TRA-BOND F123LV is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s..
Pot Life 240 min
240 min
Tra-Con Tra-Cast FS407 Low Viscosity High Temperature Epoxy Casting System
TRA-CAST FS407 is a low viscosity, solvent-free epoxy casting system recommended for rigid industrial laminating, electrical potting and transformer or coil embedding applications that require the e..
Pot Life 240 min
240 min
Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive
TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications ..
Pot Life >= 240 min

@Temperature 25.0 °C
>= 240 min

@Temperature 77.0 °F
100 grams
Trelleborg Emerson & Cuming Eccobond® 11 Heat Cure Catalyst
Emerson & Cuming 11 Eccobond® Heat Cure CatalystGeneral purpose, low viscosity, elevated temperature curing. Long working life. Yields cured coatings with excellent chemical resistance. Subject to ..
Pot Life 240 min
240 min
Tra-Con Tra-Bond 526M03 Fast Cure Epoxy Adhesive
TRA-BOND 526M03 is a fast cure, high viscosity, two-component epoxy formulation. It develops strong, tough, mechanically stable bonds to a wide variety of fiber optic and optical materials that incl..
Pot Life 240 - 360 min

@Temperature 25.0 °C
240 - 360 min

@Temperature 77.0 °F
Cytec Conathane® CC-1195 (Conap) Polyurethane Two-component Dielectric Conformal Coating
Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Pot Life 240 min
240 min
Epoxy Technology EPO-TEK® 360T High Temperature Epoxy
Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic..
Pot Life 240 min
240 min
Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other..
Pot Life 240 min
240 min
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy
Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe..
Pot Life 240 min
240 min
Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy
Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid..
Pot Life 240 min
240 min
Epoxy Technology EPO-TEK® OE101 Two Component Epoxy
Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf..
Pot Life 240 min
240 min
Epoxyset Epoxiohm EO-30M-1 Electrically Conductive Epoxy Adhesive
EO-30M-1 is a two part, semi-rigid, silver filled, epoxy adhesive. EO-30M-1 exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.Information..
Pot Life 240 min

@Temperature 75.0 °C
240 min

@Temperature 167 °F
ACC EP WQS EPI Engineered Polymers Water Base Quick Set Epoxy
EP WQS Water Base Quick Set, “Powered by Reactamine® Technology”, is a two component 60% solids, no VOC, self-leveling modified epoxy. This versatile new generation epoxy displays low blush, fast..
Pot Life 240 min

@Temperature 24.0 °C
240 min

@Temperature 75.2 °F
15 lb. mass
BCC Products BC 7009-2 Epoxy Casting
BC 7009-2 is an iron filled, low-cost mass casting system. Recommended for use in casting a minimum of two inches and a maximum of six inches in non-conductive molds. Thicknesses to nine inches in m..
Pot Life >= 240 min

@Temperature 23.0 °C
>= 240 min

@Temperature 73.4 °F
100 g mass
Aremco Aremco-Bond™ 2340 High Temperature Epoxide Potting Compound
High Temperature, Low Viscosity, Low Expansion, High Glass Transition Temperature & Chemical Resistance
Pot Life 240 min

@Temperature 25.0 °C
240 min

@Temperature 77.0 °F
100 gm mass
Aremco Aremco-Bond™ 568 High Performance Epoxide
Aluminum-Filled, 1:1, Good Bond Strength and High Thermal Conductivity.
Pot Life 240 min
240 min
uncured
Atom Adhesives AA-BOND F123 Epoxy Adhesive
AA-BOND F123 is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi..
Pot Life 240 min
240 min
500 g
Abatron AboCast 50-11/AboCure 50-1 Epoxy
Information provided by Abatron, Inc.Processing: Shelf life: 12+ months (unmixed). 100/35 ratio. Pot life: 500 g, 240 min. at 25°C(77°F). Exothermic Peak 190°C (375°F). Hardens in 2-24 hours..
Pot Life 240 min
240 min
100 g
Abatron AboCast 7802-1/AboCure 50-3 (80 pbw) Epoxy
AboCast 7802-1 is a clear resin with low viscosity (600-800 cps.) and a weight of 9.1 lbs/gallon. AboCure 50-3 is a clear, slow converter for lower rigidity. It has an HDT of 60°C, variable ratio, ..
Pot Life 240 min
240 min
100 g
Abatron AboCast 7802-1/AboCure 7804-3 (40 pbw) Epoxy
AboCast 7802-1 is a clear resin with low viscosity (600-800 cps.) and a weight of 9.1 lbs/gallon. AboCure 7804-3 a clear, slightly accelerated converter for lower rigidity. It has an HDT of 60°C, v..
Pot Life 240 min
240 min
Aremco Aremco-Bond™ 598 Conductive Epoxy Adhesive  (discontinued **)
Electrically and thermally conductive, nickel-filled, single part system. Low viscosity, inorganic coating for applications to 1000 ºF (540 °C).
Pot Life 240 min

@Temperature 25.0 °C
240 min

@Temperature 77.0 °F
Momentive Performance Materials RTV630 Blue General Purpose Potting/Encapsulating Compound
Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth..
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