Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used. Advantages & Application Notes: Ease of use: smooth flowing paste allows for automated dispensing, stamping, brushing, or hand applications.Suggested applications include: EMI and Rf shielding; ITO interconnects in LCDs; low temperature cryogenic cooling. Exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics. Hybrid/micro-electronic adhesive including die-attach and substrate attach for Rf and Microwave devices.Provides a metallic-like layer after cure.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	0.940 g/cc	0.940 g/cc	Part B
	3.43 g/cc	3.43 g/cc	Part A
Particle Size	<= 45 µm	<= 45 µm
Viscosity	55000 - 90000 cP @Temperature 23.0 °C	55000 - 90000 cP @Temperature 73.4 °F	1 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	60	60
Tensile Modulus	1.90 GPa	276 ksi	Storage
Shear Strength	10.2 MPa	1480 psi	Lap
	>= 21.1 MPa	>= 3060 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	53.0 µm/m-°C	29.4 µin/in-°F	Below Tg
	107 µm/m-°C	59.4 µin/in-°F	Above Tg
Thermal Conductivity	1.38 W/m-K	9.58 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	160 °C	320 °F	Continuous
	260 °C	500 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 30.0 °C	>= 86.0 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	316 °C	601 °F	Degradation Temperature

Electrical Properties	Metric	English
Volume Resistivity	<= 0.00050 ohm-cm @Temperature 150 °C, Time 3600 sec	<= 0.00050 ohm-cm @Temperature 302 °F, Time 1.00 hour
	<= 0.0050 ohm-cm @Temperature 80.0 °C, Time 10800 sec	<= 0.0050 ohm-cm @Temperature 176 °F, Time 3.00 hour
	<= 0.0090 ohm-cm @Temperature 23.0 °C, Time 259000 sec	<= 0.0090 ohm-cm @Temperature 73.4 °F, Time 72.0 hour

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	15 ppm	15 ppm
Ionic Impurities - K (Potassium)	1.0 ppm	1.0 ppm
Ionic Impurities - Cl (Chloride)	169 ppm	169 ppm

Processing Properties	Metric	English
Cure Time	15.0 min @Temperature 150 °C	0.250 hour @Temperature 302 °F
	180 min @Temperature 80.0 °C	3.00 hour @Temperature 176 °F
	4320 min @Temperature 23.0 °C	72.0 hour @Temperature 73.4 °F
Pot Life	240 min	240 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Amber	Part B
	Silver	Part A
Consistency	Smooth thixotropic paste
Ionic Impurities NH4	40 ppm
Mix Ratio By Weight	10:1
Number of Components	Two
Thixotropic Index	5.2
Weight Loss	0.31%	200°C
	0.65%	250°C
	1.93%	300°C

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