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- Momentive Performance Materials RTV656 Clear Extreme Low Temperature Potting/Encapsulating Compound
Momentive Performance Materials RTV656 Clear Extreme Low Temperature Potting/Encapsulating Compound
| Category | Polymer , Thermoset , Rubber or Thermoset Elastomer (TSE) , Silicone , Silicone, RTV, Encapsulation Grade |
| Manufacturer | Momentive Performance Materials (Former GE Silicones) |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Momentive Performance Materials RTV656 Clear Extreme Low Temperature Potting/Encapsulating Compound.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depths. Typical uses: Aerospace potting, bonding, and sealing where extended low temp performance is needed.Data provided by the manufacturer, GE Silicones.GE Silicones became a part of Momentive Performance Materials in 2006.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.02 g/cc | 0.0368 lb/in³ | |
| Viscosity | 4000 cP @Temperature 25.0 °C |
4000 cP @Temperature 77.0 °F |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore A | 44 | 44 | |
| Tensile Strength, Ultimate | 6.37 MPa | 924 psi | |
| Elongation at Break | 160 % | 160 % |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 270 µm/m-°C @Temperature 20.0 °C |
150 µin/in-°F @Temperature 68.0 °F |
|
| Thermal Conductivity | 0.190 W/m-K | 1.32 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 204 °C | 399 °F | Continuous useful temperature. |
| Minimum Service Temperature, Air | -115 °C | -175 °F | Continuous useful temperature. |
| Optical Properties | Metric | English | Comments |
|---|---|---|---|
| Refractive Index | 1.406 | 1.406 | |
| Transmission, Visible | 90 % | 90 % | clear; thickness not quantified |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Electrical Resistivity | 3.20e+15 ohm-cm | 3.20e+15 ohm-cm | |
| Dielectric Constant | 2.89 @Frequency 1000 Hz |
2.89 @Frequency 1000 Hz |
|
| Dielectric Strength | 19.7 kV/mm @Thickness 1.91 mm |
500 kV/in @Thickness 0.0750 in |
|
| Dissipation Factor | 0.00040 @Frequency 1000 Hz |
0.00040 @Frequency 1000 Hz |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Processing Temperature | 25.0 °C | 77.0 °F | Cure time 4 hours. |
| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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