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- Polymer Property : CTE, linear = 10.6 µin/in-°F
Polymer Property : CTE, linear = 10.6 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | X-Direction; IPC-TM-650 2.4.41 |
| Rogers Corporation LoPro™ RO4730 Antenna Grade Non-PTFE Laminate RO4730 LoPro Antenna Grade Laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. The resin systems of RO4730 dielectric materials are designed to p.. |
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| CTE, linear | 19.0 - 52.0 µm/m-°C | 10.6 - 28.9 µin/in-°F | Average value: 30.5 µm/m-°C Grade Count:29 |
| Overview of materials for Nylon 6, Glass Filled, Impact Grade This property data is a summary of similar materials in the MatWeb database for the category "Nylon 6, Glass Filled, Impact Grade". Each property range of values reported is minimum and maximum valu.. |
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| CTE, linear | 19.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
10.6 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis; IPC-TM 650-2.4.24 |
| Industrial Laminates/Norplex NP630 Paper Base Laminate Description: Machining grade with good electrical properties and moisture resistance. Low cold flow with good dimensional stability. Thickness Tested: 0.062", 0.125", and 0.500" |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Below Tg; TMA |
| Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with .. |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Alpha 1; TMA |
| Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-455 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. It is.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 0.000 - 100 °C |
10.6 µin/in-°F @Temperature 32.0 - 212 °F |
|
| Lucas-Milhaupt BRAZE 999 Commercial Grade Fine Silver Commercial grade fine silver (99.90% minimum silver) is widely used in numerous electrical, electronic, and industrial applications, such as contacts, fuse elements, lead wires, battery plated, and .. |
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| CTE, linear | 19.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
10.6 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis; IPC-TM 650-2.4.24 |
| Industrial Laminates/Norplex NP625 Paper Base Laminate Description: Paper phenolic grade with better moisture resistance than NP612. Requires less heat to punch and shear than NP611. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 °C |
10.6 µin/in-°F @Temperature 68.0 °F |
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| Loctite® 3532 High viscosity Dam Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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| CTE, linear | 19.1 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
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| Eagle Brass 240 Low Brass, 1/4 Hard CDA 240 has excellent ductility, corrosion resistance and strength which allows it to be deep drawn, etched, stamped, blanked and bent. Typical uses include musical instruments, battery caps, flexib.. |
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| CTE, linear | 19.1 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
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| Eagle Brass 240 Low Brass, Extra Hard CDA 240 has excellent ductility, corrosion resistance and strength which allows it to be deep drawn, etched, stamped, blanked and bent. Typical uses include musical instruments, battery caps, flexib.. |
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| CTE, linear | 19.1 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
|
| Eagle Brass 240 Low Brass, Extra Spring CDA 240 has excellent ductility, corrosion resistance and strength which allows it to be deep drawn, etched, stamped, blanked and bent. Typical uses include musical instruments, battery caps, flexib.. |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® OE188 High Temperature Silica-Filled Epoxy Product Description: EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications. Advantages & Application Notes: Paste-like viscosity allows for application by dispensing.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 50.0 °C |
10.6 µin/in-°F @Temperature 68.0 - 122 °F |
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| DuPont Teijin Films Melinex® ST328 Polyester Film, 1400 Gauge Melinex® ST328 is an exceptionally white, opaque film with a satin finish. It is pretreated on both surfaces to promote adhesion to a wide range of solvent-based and UV-curable graphics inks and va.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
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| CLAL-MSX SICLANIC S® TB Quenched Copper Alloy SICLANIC S® is particularly recommended for the production of conductive contact blades. SICLANIC S® offers :electrical conductivity greatly superior to that of bronzes, brasses and nickel silver.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
|
| CLAL-MSX SICLANIC S® TF Quenched Copper Alloy, precipitation treated SICLANIC S® is particularly recommended for the production of conductive contact blades. SICLANIC S® offers :electrical conductivity greatly superior to that of bronzes, brasses and nickel silver.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 100 °C |
10.6 µin/in-°F @Temperature 212 °F |
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| CMW® DSC Copper with Dispersed Aluminum Oxide CMW® DSC material is an extruded and cold worked powder metallurgy material consisting of copper and dispersed aluminum oxide. It has exceptional high temperature strength for its electrical conduc.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 300 °C |
10.6 µin/in-°F @Temperature 68.0 - 572 °F |
|
| CLAL-MSX SICLANIC S® TD3 Quenched Copper Alloy, 1/2 Hard SICLANIC S® is particularly recommended for the production of conductive contact blades. SICLANIC S® offers :electrical conductivity greatly superior to that of bronzes, brasses and nickel silver.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 - 60.0 °C |
10.6 µin/in-°F @Temperature 68.0 - 140 °F |
TMS2 Perkin Elmer |
| Arkema Group Orgalloy® RS 6030 Polyamide 6 Alloy 30% Glass Fiber reinforced Polyamide Alloy, Rigid grade, Nylon 6 basedMolding of Engineering PartsInformation provided by Arkema Group |
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| CTE, linear | 19.0 µm/m-°C | 10.6 µin/in-°F | |
| Atom Adhesives AA-DUCT 906 Epoxy Adhesive AA-DUCT 906 represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated ceramic that results in lower mat.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature 20.0 °C |
10.6 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Covestro Petlon® 3530 Semi-Crystalline PET, 30% Glass Fiber
(discontinued **) Characteristics: Excellent Electrical Properties, High Heat and Chemical ResistanceApplications: Automotive (Underhood), Appliances, Casings and HousingsProcessing: Injection Molding (Melt Temperatu.. |
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| CTE, linear | 19.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
10.6 µin/in-°F @Temperature -22.0 - 176 °F |
Borealis Method |
| Borealis Daplen™ KB4436 TPO Compound Daplen KB4436 is a 30% mineral and elastomer modified polypropylene compound intended for injection molding. Daplen KB4436 is a material with excellent impact/stiffness ratio. Thanks to its low the.. |
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| CTE, linear | 19.0 - 570 µm/m-°C | 10.6 - 317 µin/in-°F | Average value: 223 µm/m-°C Grade Count:49 |
| Overview of materials for Thermoset Fluoroelastomer This property data is a summary of similar materials in the MatWeb database for the category "Thermoset Fluoroelastomer". Each property range of values reported is minimum and maximum values of appr.. |
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