Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant

Category	Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Lord Adhesives
Trade Name	Thermoset™
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Lord Adhesives Thermosetâ„¢ ME-455 Epoxy Board Level Encapsulant.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

LORD Thermosetâ„¢ ME-455 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. It is formulated with high purity resins, fillers and additives to provide the ionic purity levels required for use in high-end microelectronic applications and minimize the chances of ion-induced corrosion in these devices.Thermoset ME-455 encapsulant offers good adhesion to silicon, laminate, ceramic, solder mask and metal surfaces. It can be used in demanding high-end, consumer and automotive applications.All information provided by Lord.

Physical Properties	Metric	English	Comments
Specific Gravity	1.69 g/cc	1.69 g/cc
Brookfield Viscosity	14000 - 24000 cP	14000 - 24000 cP	Spindle 14 @ 10rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	91 - 98	91 - 98
Modulus of Elasticity	6.00 GPa	870 ksi	DMA

Thermal Properties	Metric	English	Comments
CTE, linear	19.0 Âµm/m-Â°C	10.6 Âµin/in-Â°F	Alpha 1; TMA
	60.0 Âµm/m-Â°C	33.3 Âµin/in-Â°F	Alpha 2; TMA
Glass Transition Temp, Tg	135 Â°C	275 Â°F	TMA

Component Elements Properties	Metric	English	Comments
Potassium, K	0.00010 %	0.00010 %
Sodium, Na	0.00050 %	0.00050 %

Electrical Properties	Metric	English
Volume Resistivity	1.00e+15 ohm-cm @Temperature 25.0 Â°C	1.00e+15 ohm-cm @Temperature 77.0 Â°F
Dielectric Constant	3.5 @Frequency 1.00e+6 Hz	3.5 @Frequency 1.00e+6 Hz
Dissipation Factor	0.0080 @Frequency 1.00e+6 Hz	0.0080 @Frequency 1.00e+6 Hz

Processing Properties	Metric	English
Cure Time	30.0 min @Temperature 150 Â°C	0.500 hour @Temperature 302 Â°F
Pot Life	2160 min @Temperature 25.0 Â°C	2160 min @Temperature 77.0 Â°F
Gel Time	3.00 - 5.00 min @Temperature 150 Â°C	3.00 - 5.00 min @Temperature 302 Â°F
Shelf Life	6.00 Month @Temperature -40.0 Â°C	6.00 Month @Temperature -40.0 Â°F

Descriptive Properties	Value	Comments
Appearance	Black
Chloride (%)	0.0005
Consistency	Paste

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