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Atom Adhesives AA-DUCT 906 Epoxy Adhesive

Category Polymer , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Atom Adhesives
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Atom Adhesives AA-DUCT 906 Epoxy Adhesive.pdf
Price EMAIL US    sales@lookpolymers.com
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Material Notes:
AA-DUCT 906 represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of conventional silver conductive. AA-DUCT 906 cures at room temperature or can be accelerated with mild heat to form a tenacious bond between similar and dissimilar substrates such as aluminum, copper, magnesium, steel, bronze nickel, ceramic, glass, phenolic, and G-10 epoxy glass boards. AA-DUCT 906, because of its excellent continuity, has been used extensively in such diversified applications as, microwave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry and as a cold solder. This unique formulation offers ease in handling due to its creamy consistency and versatile application by hand, automatic dispenser, silk-screening, transfer or stamping techniquesAppearance: SilverCure Type: Heat cure or Room TemperatureBenefits:High strengthPerfect bondEMI & RFI shieldingCold SolderMix Ratio by weight: 100:5/Resin:Hardener Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Typical Application: microwave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry and as a cold solderInformation provided by Atom Adhesives
Physical Properties Metric English Comments
Specific Gravity 2.60 g/cc
2.60 g/cc
cured
Linear Mold Shrinkage 0.0040 cm/cm
0.0040 in/in
cured
Mechanical Properties Metric English Comments
Hardness, Shore D 81
81
cured
Tensile Strength 61.4 MPa
8900 psi
cured
Compressive Strength 94.5 MPa
13700 psi
cured
Thermal Properties Metric English Comments
CTE, linear 19.0 µm/m-°C
10.6 µin/in-°F
Thermal Conductivity 13.0 W/m-K
90.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 165 °C
329 °F
Heat Distortion Temperature 165 °C
329 °F
Minimum Service Temperature, Air -50.0 °C
-58.0 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 0.0015 ohm-cm
<= 0.0015 ohm-cm
Processing Properties Metric English Comments
Cure Time 15.0 min

@Temperature 100 °C
0.250 hour

@Temperature 212 °F
30.0 min

@Temperature 60.0 °C
0.500 hour

@Temperature 140 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Shelf Life 12.0 Month
12.0 Month
uncured
Descriptive Properties Value Comments
Viscosity Paste
uncured
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