Thermal Properties | Metric | English | Comments |
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CTE, linear | 22.0 - 43.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 - 23.9 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics Lexan® LGK4030 PC (Asia Pacific) |
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CTE, linear | 22.0 - 50.0 µm/m-°C | 12.2 - 27.8 µin/in-°F | Average value: 36.0 µm/m-°C Grade Count:3 |
Overview of materials for Polystyrene, Wood Filled This property data is a summary of similar materials in the MatWeb database for the category "Polystyrene, Wood Filled". Each property range of values reported is minimum and maximum values of appro.. |
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CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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Cookson Group Plaskon® 440 Mineral Filled Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate semiconductor devi.. |
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CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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Cookson Group Plaskon® 440S Mineral Filled Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide process latitude. This material is designed to encapsulate a wide range of semiconduc.. |
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CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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Cookson Group Plaskon® 3400FP Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs .. |
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CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1105-7920/RD PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
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CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 50/CF/10/GF/20/BK Polycarbonate, with carbon fiber and glass fiber Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi.. |
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CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy® 19 In-Bi-Sn Fusible Alloy Environmentally safe fusible alloy. Contains no lead or cadmium.Information provided by the manufacturer, Indium Corporation. |
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CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | |
Lord Adhesives Circalokâ„¢ 6037 Epoxy Adhesive Circalokâ„¢ 6037 is an epoxy adhesive formulated for use by the semiconductor industry. An easy-to-spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of ther.. |
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CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1105/GF/30/TF/15 PEEK, with glass fiber and PTFE Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Dynamic stressed parts at high movement velocity.Chemical and hydrolysis resistance parts,.. |
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CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1105-0904/GN PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.High dimensionally stable precision parts, high continuous use tempera.. |
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CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
GEHR Plastics PEEK-30GF Polyetheretherketone, 30% Glass Fiber Polyether etherketone can be used at very high temperatures and it shows a good mechanical strength, toughness, hardness, flexural strength, and torsional strength. PEEK exhibits excellent chemical .. |
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CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1105-0858 PEEK, with glass fiber, easy flowing Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.High dimensionally stable precision parts, high continuous use tempera.. |
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CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1105-0918/BL PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
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CTE, linear | 22.0 µm/m-°C @Temperature 23.0 - 85.0 °C |
12.2 µin/in-°F @Temperature 73.4 - 185 °F |
ASTM E831 |
Solvay Technyl® A 218 V35 Nylon 66, 35% Glass Fiber, EH0 Polyamides PA66, reinforced with 35% of glass fiber, heat stabilized, for injection molding.Technyl A 218 V35 is used in all sectors of industry, offering an excellent combination between thermal an.. |
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CTE, linear | 22.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
12.2 µin/in-°F @Temperature 73.4 - 140 °F |
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Sumitomo Bakelite Sumikon® PM-9501 Glass-Filled Phenolic, Injection Grade Sumikon PM-9501 is a two stage glass fiber and mineral filled black phenolic special purpose molding compound. It is especially designed for applications requiring high strength and dimensional s.. |
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CTE, linear | 22.0 - 25.0 µm/m-°C | 12.2 - 13.9 µin/in-°F | |
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation .. |
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CTE, linear | 22.0 - 25.0 µm/m-°C | 12.2 - 13.9 µin/in-°F | |
Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t.. |
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CTE, linear | 22.0 - 25.0 µm/m-°C | 12.2 - 13.9 µin/in-°F | |
Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi.. |
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CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | ISO 11359-2 |
Unitika A1022GFL60 PA6, 60% Glass Fiber Reinforced, Dry Information provided by Unitika Ltd. |
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CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
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CTE, linear | 22.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
BASF Petra® 140 45% Glass Filled PET Petra 140 is a 45% glass reinforced injection molding polyethylene terephthalate (PET) offering an increased level of strength, stiffness, high temperature performance and dimensional stability. Ex.. |
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CTE, linear | 22.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
BASF Petra® 140 BK-112 45% Glass Filled PET Petra 140 BK-112 is a 45% glass reinforced, pigmented black, polyethylene terephthalate (PET) injection molding compound offering an increased level of strength, stiffness, high temperature performa.. |
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CTE, linear | 22.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
Beijing Chemical Industry KAIFA® 551-GT30S PBT Resin Glass fiber and mineral filled, flame retardant, low warpage, superior electrical performanceInformation provided by Beijing Chemical Industry Research Institute (Group) |
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CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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AIM 70 Fusible Alloy Uses: punch and die in short run sheet metal forming; external and internal support for bending tubing extrusions; holding jet engine blades for machining and broaching; annealing and nitriding seal.. |
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CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
ASTM D-696 |
Glastic GLASGUARD Scuff and Bulkhead Liners GlasGuard Scuff and Bulkhead Liners serve as a method of protecting trailer walls from damage caused by forklift trucks and careless loading and unloading of freight. Manufactured of 1/4" thick fib.. |
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CTE, linear | 22.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
BASF Petra® 230 BK-112 22/13% Glass/Mineral Filled PET Petra 230 BK-112 is a 35% mineral and glass fiber reinforced, black pigmented, polyethylene terephthalate injection molding compound. It exhibits a very good combination of performance properties in.. |