Cookson Group Plaskon® 3400FP Epoxy Molding Compound (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® 3400FP Epoxy Molding Compound (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. Fast cycle times; Excellent moldability (ease of filling, good release, minimal flash and bleed and good hot hardness); Superior cosmetics; Improved markability; Minimal mold cleaning frequency

Physical Properties	Metric	English	Comments
Density	1.80 g/cc	0.0650 lb/in³
Viscosity	14000 cP @Temperature 175 °C	14000 cP @Temperature 347 °F	Automatic orifice Viscosity
Spiral Flow	59.0 - 83.0 cm	23.2 - 32.7 in	177°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	70	70
Flexural Strength	124 MPa	18000 psi
Flexural Modulus	15.0 GPa	2180 ksi

Thermal Properties	Metric	English
CTE, linear	22.0 µm/m-°C @Temperature 20.0 °C	12.2 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	60.0 µm/m-°C @Temperature 20.0 °C	33.3 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	150 °C	302 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Electrical Properties	Metric	English
Dielectric Constant	3.6 @Frequency 1000 Hz	3.6 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm	406 kV/in
Dissipation Factor	0.0030 @Frequency 1000 Hz	0.0030 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec

Processing Properties	Metric	English	Comments
Processing Temperature	170 - 185 °C	338 - 365 °F	Molding temperature

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