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- Cookson Group Plaskon® 3400FP Epoxy Molding Compound (discontinued **)
Cookson Group Plaskon® 3400FP Epoxy Molding Compound (discontinued **)
| Category | Polymer , Thermoset , Epoxy , Epoxy Molding Compound |
| Manufacturer | |
| Trade Name | |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Cookson Group Plaskon® 3400FP Epoxy Molding Compound
(discontinued **).pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. Fast cycle times; Excellent moldability (ease of filling, good release, minimal flash and bleed and good hot hardness); Superior cosmetics; Improved markability; Minimal mold cleaning frequency
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.80 g/cc | 0.0650 lb/in³ | |
| Viscosity | 14000 cP @Temperature 175 °C |
14000 cP @Temperature 347 °F |
Automatic orifice Viscosity |
| Spiral Flow | 59.0 - 83.0 cm | 23.2 - 32.7 in | 177°C/1000 psi |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 70 | 70 | |
| Flexural Strength | 124 MPa | 18000 psi | |
| Flexural Modulus | 15.0 GPa | 2180 ksi |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| CTE, linear, Transverse to Flow | 60.0 µm/m-°C @Temperature 20.0 °C |
33.3 µin/in-°F @Temperature 68.0 °F |
|
| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Glass Transition Temp, Tg | 150 °C | 302 °F | |
| Flammability, UL94 | V-0 @Thickness 3.20 mm |
V-0 @Thickness 0.126 in |
|
| V-0 @Thickness 3.20 mm |
V-0 @Thickness 0.126 in |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Dielectric Constant | 3.6 @Frequency 1000 Hz |
3.6 @Frequency 1000 Hz |
|
| Dielectric Strength | 16.0 kV/mm | 406 kV/in | |
| Dissipation Factor | 0.0030 @Frequency 1000 Hz |
0.0030 @Frequency 1000 Hz |
|
| Arc Resistance | 180 sec | 180 sec |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Processing Temperature | 170 - 185 °C | 338 - 365 °F | Molding temperature |
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