Cookson Group Plaskon® 440 Mineral Filled Novolac Epoxy Molding Compound (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy, Molded, Mineral Filled , Filled/Reinforced Thermoset
Manufacturer
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® 440 Mineral Filled Novolac Epoxy Molding Compound (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate semiconductor devices including diodes, transistors, and integrated circuits in dual in-line packages, quad packs, and small outline packages.

Physical Properties	Metric	English	Comments
Density	1.80 g/cc	0.0650 lb/in³
Spiral Flow	63.0 - 87.0 cm	24.8 - 34.3 in	177°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	85	85
Tensile Strength, Ultimate	97.0 MPa	14100 psi
Flexural Strength	147 MPa	21300 psi

Thermal Properties	Metric	English
CTE, linear	22.0 µm/m-°C @Temperature 20.0 °C	12.2 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	70.0 µm/m-°C @Temperature 20.0 °C	38.9 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.600 W/m-K	4.16 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	165 °C	329 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Electrical Properties	Metric	English
Dielectric Constant	3.8 @Frequency 1000 Hz	3.8 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm	406 kV/in
Dissipation Factor	0.0060 @Frequency 1000 Hz	0.0060 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec

Processing Properties	Metric	English	Comments
Processing Temperature	175 - 185 °C	347 - 365 °F	Molding temperature

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