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Polymer Property : Deflection Temperature at 1.8 MPa (264 psi) = 351 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
Plastcom SLOVASTER® B/A GF 30 PBT, 30% glass fibre
FeaturesPBT/ASA for injection moulding, chemically reinforced with 30% glass fibre. Characterised by excellent properties also at minus temperatures like eg. modulus of elasticity in tension and ben..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
Flatw 80*10*4 sp=64mm; ISO 75/Af
SABIC Innovative Plastics LNP Faradex ES003DE PEI
LNP* Faradex* ES003DE is a Polyetherimide resin containing stainless steel fibers. Characteristics of this grade are EMI/RFI Shielding.This data was supplied by SABIC-IP for the Americas region.
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
Flatw 80*10*4 sp=64mm; ISO 75/Af
SABIC Innovative Plastics LNP FARADEX ES003E PEI
LNP* FARADEX* ES003E is a Polyetherimide resin containing 15% Stainless Steel Fibers. Added feature of this grade is: EMI/RFI Shielding.
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Resinoid 2002-4 Phenolic Molding, Fabric Reinforced
Data provided by the manufacturer.The Resinoid 2000 organic fiber reinforced series compounds feature mechanical strength, dimensional stability, and shock resistance
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Plenco 7466 Phenolic, Nodular, Injection Molded  (discontinued **)
Two-Stage Phenolic. PLENCO 07466 is a flock cotton and mineral filled phenolic molding compound offering excellent heat resistance and dimensional stability. UL recognized under component file E406..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Plenco 202 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **)
Plaslok 202 is a two-stage, woodflour-filled phenolic molding compound formulated to provide improved impact and fatigue strength, good dimensional stability and excellent molded finish for automoti..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Plenco 5440 Black General Purpose Phenolic Molding Compound  (discontinued **)
Plaslok 5440 is the replacement material for the former Union Carbide BMRS-5440. It is a two-stage, phenolic molding compound that has been successfully formulated to accommodate a very wide range ..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Plaslok 301 Black Impact Grade Woodflour/Flock Filled Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 301 is a two-stage, woodflour and flo..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ISO 75-1,-2
Gromax BFM30-EL04B2 Nylon 6 30% Mineral Filled (Dry)
Information provided by Gromax Enterprises Corp.
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
Flatw 80*10*4 sp=64mm; ISO 75/Af
SABIC Innovative Plastics LNP STAT-KON Noryl_HMC202M PPE+HIPS (Europe-Africa-Middle East)
DATA ON BK1005 ONLY.
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
Flatw 80*10*4 sp=64mm; ISO 75/Af
SABIC Innovative Plastics LNP STAT-KON Noryl_HMC202M PPE+PS
DATA ON BK1005 ONLY.
Deflection Temperature at 1.8 MPa (264 psi) 177 °C

@Thickness 3.20 mm
351 °F

@Thickness 0.126 in
unannealed; ASTM D648
SABIC Innovative Plastics LNP THERMOCOMP HF008 PA 11 (Asia Pacific)
LNP* THERMOCOMP* HF008 is a compound based on Nylon 11 resin containing Glass Fiber.
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Sumitomo Bakelite Durez® 153 Phenolic, Compression Grade
Durez 153 Black Phenolic is a two-stage, asbestos-free, heat resistant/electrical molding material. It exhibits good molded appearance and shock resistance for use on a wide variety of electrical a..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Sumitomo Bakelite Durez® 153 Phenolic, Injection Grade
Durez 153 Black Phenolic is a two-stage, asbestos-free, heat resistant/electrical molding material. It exhibits good molded appearance and shock resistance for use on a wide variety of electrical a..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Sumitomo Bakelite Durez® 31735 Phenolic, Compression Grade
Durez 31735 is a special purpose phenolic molding compound developed for automotive and industrial pulleys. This material is designed to optimize pulley performance relating to belt life, dimension..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C

@Thickness 3.20 mm
351 °F

@Thickness 0.126 in
unannealed; ASTM D648
SABIC Innovative Plastics LNP STAT-LOY WF306C PBT
LNP* STAT-LOY* WF306C is a compound based on PBT resin containing 30% Glass Fiber. Added features of this material include: Antistat, Clean Compound System.
Deflection Temperature at 1.8 MPa (264 psi) 177 °C

@Thickness 3.20 mm
351 °F

@Thickness 0.126 in
unannealed; ASTM D648
SABIC Innovative Plastics LNP STAT-LOY WF306C PBT (Asia Pacific)
LNP* Stat-loy* WF306C is a compound based on Polybutylene Terephalate resin containing Glass Fiber. Added features of this material include: Antistat, Clean Compounding System.
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Sumitomo Bakelite Durez® 32962 Phenolic Molding Compound, Injection Grade
Durez 32962 Black Phenolic is a medium impact, molding compound. It is designed for applications where additional mechanical strength is required. Typical applications include appliance housings whe..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Plenco 00732 Melamine-Phenolic, Granular, Injection Molded
PLENCO 00732 is a melamine-phenolic copolymer molding compound, exhibiting excellent electrical and flame resistant properties. Type ASTM 5948 CMG, and UL recognized under component file E40654. 007..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Plenco 2369 Phenolic, Granular, Transfer Molded
PLENCO 02369 is a general purpose, organic filled phenolic molding compound, formulated to minimize the generation of free ammonia for applications that are sensitive to such formation. PLENCO 02369..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
Heat Distortion temperature
Cosmic Plastics D45 Mineral Filled Ortho Diallyl Phthalate Molding Compound
Data provided by the manufacturer.
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
Flatw 80x10x4, sp=64 mm; ISO 75/Af
Eurostar Staramide PF004EUC PA6, 20% Glass Filled, Injection Molded
PF004EUC is a 20% Glass Fiber Reinforced Polyamide 6 Injection Molding ResinInformation provided by Polymer Technology & Services, the North American exclusive supplier.
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Ashley Polymers Ashlene® D925LH-30G Nylon 12, 30% Glass Reinforced
A 30% glass reinforced heat and light stabilized Nylon 12.Data provided by the manufacturer
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Ashley Polymers Ashlene® 742L-33G Nylon 6/66, 33% Glass Reinforced
6/66 Copolymer with high surface gloss in addition to high stiffness and strength, 33% Glass Reinforced.Data provided by the manufacturer
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
ALM PA 601-CF Filled Nylon 12 Prototyping Polymer
Carbon fiber filled nylon 12 easy to process, strong light weight filled material.Low density, good dimensional stability while maintaining excellent mechanical properties.Fibers have been optimized..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Plenco 2000 Phenolic, Granular, Transfer Molded
PLENCO 02000 is a versatile general purpose, organic filled phenolic molding compound, offering optimum cure characteristics and an excellent balance of molding properties. UL recognized under compo..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Plenco 301 Black Impact Grade Woodflour/Flock Filled Phenolic Molding Compound  (discontinued **)
Plaslok 301 is a two-stage, woodflour and flock-filled phenolic molding compound. It has broad molding latitude combined with good electrical properties and improved impact strength. It is particu..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Plaslok 5440 Black General Purpose Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5440 is the replacement material for ..
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
Heat Distortion temperature
Cosmic Plastics D44 Mineral Filled Ortho Diallyl Phthalate Molding Compound
Data provided by the manufacturer.
Deflection Temperature at 1.8 MPa (264 psi) 177 °C
351 °F
ASTM D648
Plaslok 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 501 is a two-stage, mineral and flock..
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