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AIM 54Sn/26Pb/20In Solder for Photonic Packaging

Category Metal , Nonferrous Metal , Solder/Braze Alloy , Tin Alloy
Manufacturer AIM Specialty Materials
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF AIM 54Sn/26Pb/20In Solder for Photonic Packaging.pdf
Price EMAIL US    sales@lookpolymers.com
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Material Notes:
Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
Physical Properties Metric English Comments
Density 8.10 g/cc
0.293 lb/in³
Thermal Properties Metric English Comments
CTE, linear 25.0 µm/m-°C

@Temperature 20.0 °C
13.9 µin/in-°F

@Temperature 68.0 °F
Melting Point 138 - 170 °C
280 - 338 °F
Solidus 138 °C
280 °F
Liquidus 170 °C
338 °F
Component Elements Properties Metric English Comments
Indium, In 20 %
20 %
Lead, Pb 26 %
26 %
Tin, Sn 54 %
54 %
Descriptive Properties Value Comments
Creep Resistance Moderate
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