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Polymer Property : Solidus = 1080 °C Product List

Thermal Properties

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Thermal Properties Metric English Comments
Solidus 1080 °C
1980 °F
Osprey Metals HTN 5 Brazing Powder
Particle size distribution 1-250 microns.SHAPE: Predominantly spherical PACKAGING: 4 & 20 Kg. Chemical composition and particle size distribution can be adjusted to suit customers' requireme..
Solidus 1080 °C
1980 °F
CMW® ELKONITE® 2140C Copper Tungsten Nickel material
For structural rotors.Information provided by CMW Inc.
Solidus 1080 °C
1980 °F
CMW® ELKONITE® 30W3 Infiltrated Copper Tungsten contact material ASTM B702, Class E, infiltrated, RWMA Class 12
For projection welding dies, die facing, and resistance welding electrodes. Also used for low expansion structural members. Information provided by CMW Inc.
Solidus 1080 °C
1980 °F
CMW® ELKONITE® 3W3 Tungsten Copper material ASTM B702
For arcing and current carrying electrical contacts, power transformer contacts, resistance welding electrodes.Information provided by CMW Inc.
Solidus 1080 °C
1980 °F
CMW® ELKONITE® 3W53 Heat Treatable Tungsten Copper material
For resistance welding electrodes.Information provided by CMW Inc.
Solidus 1080 °C
1980 °F
CMW® ELKONITE® 40W3 Infiltrated Tungsten Copper material ASTM B702
For vacuum switch contacts, low expansion structural members.Information provided by CMW Inc.
Solidus 1080 °C
1980 °F
CMW® ELKONITE® 50W3 Tungsten Copper material ASTM B702
For vacuum switch contacts.Information provided by CMW Inc.
Solidus 1080 °C
1980 °F
CMW® ELKONITE® 5W3 Tungsten Copper material ASTM B702, Class C, infiltrated
For arcing and current carrying electrical contacts; power transformer contacts.Information provided by CMW Inc.
Solidus 1080 °C
1980 °F
CMW® THERMKON® 62 Tungsten Copper parts
For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc.
Solidus 1080 °C
1980 °F
CMW® THERMKON® 65M Molybdenum Copper parts
For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc.
Solidus 1080 °C
1980 °F
CMW® THERMKON® 68 Tungsten Copper parts
For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc.
Solidus 1080 °C
1980 °F
CMW® THERMKON® 70M Molybdenum Copper parts
For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc.
Solidus 1080 °C
1980 °F
CMW® THERMKON® 76 Tungsten Copper parts
For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc.
Solidus 1080 °C
1980 °F
CMW® THERMKON® 83 Tungsten Copper parts
For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc.
Solidus 1080 °C
1980 °F
Kennametal Stellite Nucalloy® 430 High-Silicon Nickel-Base Hardfacing Alloy
Applications include components of chemical processing.Nucalloy® alloys are unique, patented, high-silicon, nickel-base hardfacing alloys that are designed to have optimum combinations of hardness ..
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