- HOME
- POLYMER SEARCH
- Polymer Property : CTE, linear = 58.0 µm/m-°C
Polymer Property : CTE, linear = 58.0 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 58.0 µm/m-°C @Temperature 20.0 °C |
32.2 µin/in-°F @Temperature 68.0 °F |
|
| North Wood Plastics HDPE with 40% Wood Fiber Data provided by North Wood Plastics, Inc. |
|||
| CTE, linear | 58.0 µm/m-°C @Temperature 20.0 °C |
32.2 µin/in-°F @Temperature 68.0 °F |
NOVA |
| NOVA Chemicals Dylark® 480P12 High Performance Glass Filled Styrenic Very high modulus, High heat resistance, Excellent flow characteristics, Excellent adhesion to urethaneApplications: Instrument panel substrates, consoles, Cluster housing, interior trimInjection Sp.. |
|||
| CTE, linear | 58.0 µm/m-°C @Temperature 20.0 °C |
32.2 µin/in-°F @Temperature 68.0 °F |
|
| Resin Technology Group TIGA 291-EX Grey Medium Viscosity Polyamide Epoxy Adhesive Mix ratio 1 to 1 by weight.Tiga 291 EX Grey is a medium viscosity polyamide/ epoxy adhesive recommended for bonding applications where high shock impact resistance and peel resistance are desired. T.. |
|||
| CTE, linear | 58.0 µm/m-°C @Temperature 20.0 °C |
32.2 µin/in-°F @Temperature 68.0 °F |
|
| Plenco 7300 Phenolic, Nodular, Transfer Molded
(discontinued **) Two-Stage Phenolic. PLENCO 07300 is an organic fiber reinforced phenolic molding compound offering improved mechanical strength and excellent cosmetic properties. UL recognized under component file.. |
|||
| CTE, linear | 58.0 µm/m-°C | 32.2 µin/in-°F | ASTM E831-93 |
| Saint-Gobain Meldin® 2211 Bearing General Notes on Meldin 2000 Series Bearing Products:For High-Temperature, Close-Tolerance Applications. Able to withstand temperatures of 600°F with excursions to 900°F, the Medlin 2000 Ser.. |
|||
| CTE, linear | 58.0 µm/m-°C @Temperature 40.0 - 130 °C |
32.2 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 3509 Phenolic, Granular, Compression Molded PLENCO 03509 is a mineral and flock filled phenolic molding compound offering excellent electrical properties, dimensional stability, and improved heat resistance. UL recognized under component file.. |
|||
| CTE, linear | 58.0 µm/m-°C @Temperature 40.0 - 130 °C |
32.2 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 7500 Phenolic, Granular, Transfer Molded PLENCO 07500 is an organic reinforced phenolic molding compound, offering improved mechanical strength and excellent cosmetic characteristics. Type ASTM 5948 CFG and UL recognized under component fi.. |
|||
| CTE, linear | 58.0 µm/m-°C | 32.2 µin/in-°F | Absolute Drying; ASTM-D696 |
| Toyobo GLAMIDE® TY-835TC Nylon-66 GLAMIDE® is very tough and exhibits high abrasion resistance. It has a high melting point and heat resistance, has well-balanced proportions of mechanical properties, performs self-distinguishing a.. |
|||
| CTE, linear | 58.0 µm/m-°C @Temperature 20.0 °C |
32.2 µin/in-°F @Temperature 68.0 °F |
|
| Tra-Con Tra-Bond FS152C Clear Low Viscosity Epoxy Adhesive TRA-BOND FS152C is a low viscosity epoxy system containing no solvents, cures at room temperature and has excellent flow and wetting characteristics. This two-part adhesive mixes easily and develops.. |
|||
| CTE, linear | 58.0 µm/m-°C @Temperature 20.0 °C |
32.2 µin/in-°F @Temperature 68.0 °F |
|
| Tra-Con Tra-Bond 2129 Clear Low Viscosity Epoxy Adhesive TRA-BOND 2129 is a low viscosity epoxy adhesive recommended for industrial and electronic production, repair, small casting, coating, tooling, and rigid laminating applications where a clear system .. |
|||
| CTE, linear | 58.0 µm/m-°C | 32.2 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® OG142 UV Cure Optical Epoxy Material Description: A single component, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientif.. |
|||
| CTE, linear | 58.0 µm/m-°C | 32.2 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® OG159-2 UV Cure Optical Epoxy Material Description: A single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bon.. |
|||
| CTE, linear | 58.0 µm/m-°C | 32.2 µin/in-°F | Second heat; ASTM-D696 |
| 3M 9458 Adhesive Transfer Tapes with Adhesive 300 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 300 offer excellent adhesion to a wide variety of surfaces, including low surface energy plastics and foam. This pressure sensitive acrylic adhesive f.. |
|||
| CTE, linear | 58.0 µm/m-°C | 32.2 µin/in-°F | Second heat; ASTM-D696 |
| 3M 9471 Adhesive Transfer Tapes with Adhesive 300 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 300 offer excellent adhesion to a wide variety of surfaces, including low surface energy plastics and foam. This pressure sensitive acrylic adhesive f.. |
|||
| CTE, linear | 58.0 µm/m-°C | 32.2 µin/in-°F | Second heat; ASTM-D696 |
| 3M 9472 Adhesive Transfer Tapes with Adhesive 300 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 300 offer excellent adhesion to a wide variety of surfaces, including low surface energy plastics and foam. This pressure sensitive acrylic adhesive f.. |
|||
| CTE, linear | 58.0 µm/m-°C | 32.2 µin/in-°F | Second heat; ASTM-D696 |
| 3M 9671 Adhesive Transfer Tapes with Adhesive 300 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 300 offer excellent adhesion to a wide variety of surfaces, including low surface energy plastics and foam. This pressure sensitive acrylic adhesive f.. |
|||
| CTE, linear | 58.0 µm/m-°C | 32.2 µin/in-°F | Second heat; ASTM-D696 |
| 3M 9672 Adhesive Transfer Tapes with Adhesive 300 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 300 offer excellent adhesion to a wide variety of surfaces, including low surface energy plastics and foam. This pressure sensitive acrylic adhesive f.. |
|||
| CTE, linear | 58.0 µm/m-°C | 32.2 µin/in-°F | Second heat; ASTM-D696 |
| 3M 9673 Adhesive Transfer Tapes with Adhesive 300 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 300 offer excellent adhesion to a wide variety of surfaces, including low surface energy plastics and foam. This pressure sensitive acrylic adhesive f.. |
|||
| CTE, linear | 58.0 µm/m-°C | 32.2 µin/in-°F | Second heat; ASTM-D696 |
| 3M 9674 Adhesive Transfer Tapes with Adhesive 300 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 300 offer excellent adhesion to a wide variety of surfaces, including low surface energy plastics and foam. This pressure sensitive acrylic adhesive f.. |
|||
| CTE, linear | 58.0 µm/m-°C @Temperature 20.0 °C |
32.2 µin/in-°F @Temperature 68.0 °F |
|
| Armstrong A-2/H20 Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac.. |
|||
| CTE, linear | 58.0 µm/m-°C @Temperature 20.0 °C |
32.2 µin/in-°F @Temperature 68.0 °F |
|
| Armstrong A-702 Epoxy Adhesive Information provided by Ellsworth Adhesives. |
|||
| CTE, linear | 58.0 µm/m-°C | 32.2 µin/in-°F | Second heat; ASTM-D696 |
| 3M 9471PC Adhesive Transfer Tapes with Adhesive 300 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 300 offer excellent adhesion to a wide variety of surfaces, including low surface energy plastics and foam. This pressure sensitive acrylic adhesive f.. |
|||
| CTE, linear | 58.0 µm/m-°C @Temperature 20.0 °C |
32.2 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Devcon Fastmeal™ Epoxy Precision Repair EpoxyComments: High-performance, alumina-filled epoxy putty for making fast, dependable emergency repair to leaks in pipes carrying ores, coal, cement, san and gravel. Cures in 5 m.. |
|||
| CTE, linear | 58.0 µm/m-°C @Temperature 20.0 °C |
32.2 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Devcon Wear Guard (High Load) Epoxy Abrasion-Resistant SystemComments: PuttyData provided by Ellsworth Adhesives. |
|||
| CTE, linear | 58.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
32.2 µin/in-°F @Temperature -22.0 - 176 °F |
Borealis Method |
| Borealis ME268Al Polypropylene Compound, Mineral Filled ME268AI is a 20% mineral filled polypropylene compound intended for injection molding. Applications: ME268AI has been developed especially for the car industry to be used in automotive interior par.. |
|||
| CTE, linear | 58.0 µm/m-°C @Temperature 40.0 - 130 °C |
32.2 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 4485 Phenolic, Granular, Transfer Molded PLENCO 04485 is a mineral filled phenolic molding compound offering excellent heat resistance, electrical resistance, and dimensional stability. UL recognized under component file E40654. 04485 is a.. |
|||
Copyright © lookpolymers.com All Rights Reserved