Polymer Property : CTE, linear = 11.1 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	20.0 µm/m-°C @Temperature 0.000 - 140 °C	11.1 µin/in-°F @Temperature 32.0 - 284 °F	Z-Direction; ASTM D3386
Rogers Corporation TMM® TMM10 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope..
CTE, linear	20.0 µm/m-°C @Temperature 1000 °C	11.1 µin/in-°F @Temperature 1830 °F
Outokumpu 4833 High Temperature Austenitic Stainless Steel Standardized high temperature steel for service at temperatures of up to 950-1000°C in dry air. Utilization in the temperature range of 600-900°C can lead to embrittlement.Applications: Heat and ..
CTE, linear	20.0 µm/m-°C @Temperature -80.0 - 225 °C	11.1 µin/in-°F @Temperature -112 - 437 °F	(12µm polyimide/9µm copper); ASTM E831-06
NeXolve TR-Clad™ Flexible Polyimide Laminate The lightest weight copper clad laminates available.TR-Clad™ Flexible Laminates are both the lowest weight and lowest dielectric constant of copper/polyimide laminates available. Additionally, TR..
CTE, linear	20.0 µm/m-°C @Temperature 250 °C	11.1 µin/in-°F @Temperature 482 °F
Chevron Phillips Ryton® A-200 PPS Polyphenylene Sulfide (discontinued **) Ryton® PPS is used in many electronic and automotive applications because of its high strength, favorable electrical properties, and high temperature stability.Data provided by the manufacturer.Sol..
CTE, linear	20.0 µm/m-°C @Temperature <=143 °C	11.1 µin/in-°F @Temperature <=289 °F	ISO 11359
Victrex® PEEK 150GL30 30% Glass Fiber Reinforced Product Description: High performance thermoplastic material, 30% glass fibre reinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection moulding, easy flow, FDA food contact c..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Alpha 1; TMA
Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the..
CTE, linear	20.0 µm/m-°C @Temperature -50.0 - 50.0 °C	11.1 µin/in-°F @Temperature -58.0 - 122 °F	Axial; ISO 11359-2
Chevron Phillips Xtel® XE3035BL Polyphenylene Sulfide Alloy Xtel® XE3035BL is a high performance, glass fiber reinforced, PPS based alloy developed to provide exceptionally high ductility and impact resistance along with good thermal stability.Information p..
CTE, linear	20.0 µm/m-°C @Temperature -50.0 - 50.0 °C	11.1 µin/in-°F @Temperature -58.0 - 122 °F	Axial; ISO 11359-2
Chevron Phillips Xtel® XE4050BL Polyphenylene Sulfide Alloy Xtel® XE4050BL is a glass fiber and mineral filled PPS based alloy developed to provide high ductility and impact strength along with good thermal stability.Information provided by Chevron Phillips..
CTE, linear	20.0 µm/m-°C @Temperature -50.0 - 50.0 °C	11.1 µin/in-°F @Temperature -58.0 - 122 °F	Axial; ISO 11359-2
Chevron Phillips Xtel® XE5030BL Polyphenylene Sulfide Alloy Xtel® XE5030BL is a high performance, glass fiber reinforced, PPS based alloy developed to provide high ductility and impact strength along with good thermal stability.Information provided by Chevr..
CTE, linear	20.0 µm/m-°C @Temperature 21.0 - 871 °C	11.1 µin/in-°F @Temperature 69.8 - 1600 °F
Crucible Steel XM-19 Stainless Steel Crucible XM-19 Stainless is a nitrogen strengthened, low carbon, austenitic, stainless steel that provides good corrosion resistance in combination with high strength. The alloy has better corrosio..
CTE, linear	20.0 µm/m-°C @Temperature -14.0 - 38.0 °C	11.1 µin/in-°F @Temperature 6.80 - 100 °F	ASTM D696-91
DuPont™ Kapton® 100HN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 100ZT Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 200A Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an ar..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 300A Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an a..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 300ZT Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 500FPC Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thic..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 500ZT Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available ..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 50EN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications req..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 50FPC Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick..
CTE, linear	20.0 µm/m-°C @Temperature -14.0 - 38.0 °C	11.1 µin/in-°F @Temperature 6.80 - 100 °F	25 µm film; ASTM D696-91
DuPont™ Kapton® 50HN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 50ZT Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 100FPC Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick..
CTE, linear	19.9 µm/m-°C @Temperature 125 - 175 °C	11.1 µin/in-°F @Temperature 257 - 347 °F	First heat; ASTM-D696
3M 941 Adhesive Transfer Tapes with Adhesive 100 These 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 100 are designed for temperature exposure to 450°F (232°C) for short periods of time and/or solvent resistance. They have exceptional shear va..
CTE, linear	19.9 µm/m-°C @Temperature 125 - 175 °C	11.1 µin/in-°F @Temperature 257 - 347 °F	First heat; ASTM-D696
3M 9461PC Adhesive Transfer Tapes with Adhesive 100 These 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 100 are designed for temperature exposure to 450°F (232°C) for short periods of time and/or solvent resistance. They have exceptional shear va..
CTE, linear	19.9 µm/m-°C @Temperature 125 - 175 °C	11.1 µin/in-°F @Temperature 257 - 347 °F	First heat; ASTM-D696
3M 966 Adhesive Transfer Tapes with Adhesive 100 These 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 100 are designed for temperature exposure to 450°F (232°C) for short periods of time and/or solvent resistance. They have exceptional shear va..
CTE, linear	19.9 µm/m-°C @Temperature <=871 °C	11.1 µin/in-°F @Temperature <=1600 °F
AK Steel 316L Austenitic Stainless steel AK Steel 316L is an extra-low carbon version of AK Steel 316 that minimizes harmful carbide precipitation due to welding.Information provided by AK Steel
CTE, linear	19.9 µm/m-°C @Temperature 125 - 175 °C	11.1 µin/in-°F @Temperature 257 - 347 °F	First heat; ASTM-D696
3M 9462P Adhesive Transfer Tapes with Adhesive 100 These 3M™ Adhesive Transfer Tapes with 3M™ Adhesive 100 are designed for temperature exposure to 450°F (232°C) for short periods of time and/or solvent resistance. They have exceptional shear va..
CTE, linear	19.9 µm/m-°C @Temperature <=871 °C	11.1 µin/in-°F @Temperature <=1600 °F
AK Steel 316 Austenitic Stainless steel AK Steel 316 contains molybdenum. This addition increases general corrosion resistance, improves resistance to pitting from chloride ion solutions, and provides increased strength at elevated tempe..
CTE, linear	20.0 µm/m-°C @Temperature -14.0 - 38.0 °C	11.1 µin/in-°F @Temperature 6.80 - 100 °F	25 µm film; ASTM D696-91
DuPont™ Kapton® 200HN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General ..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 200VN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available in..