Polymer Property : CTE, linear = 20.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	20.0 µm/m-°C @Temperature 0.000 - 140 °C	11.1 µin/in-°F @Temperature 32.0 - 284 °F	Z-Direction; ASTM D3386
Rogers Corporation TMM® TMM10 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope..
CTE, linear	20.0 µm/m-°C @Temperature 0.000 - 140 °C	11.1 µin/in-°F @Temperature 32.0 - 284 °F	Z-Direction; ASTM D3386
Rogers Corporation TMM® TMM101 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope..
CTE, linear	20.0 µm/m-°C @Temperature 1000 °C	11.1 µin/in-°F @Temperature 1830 °F
Outokumpu 4828 High Temperature Austenitic Stainless Steel Standardized high temperature steel for service at temperatures of up to 950-1000°C in dry air. Utilization in the temperature range of 600-900°C can lead to embrittlement.Applications: Heat and ..
CTE, linear	20.0 µm/m-°C @Temperature 1000 °C	11.1 µin/in-°F @Temperature 1830 °F
Outokumpu 4833 High Temperature Austenitic Stainless Steel Standardized high temperature steel for service at temperatures of up to 950-1000°C in dry air. Utilization in the temperature range of 600-900°C can lead to embrittlement.Applications: Heat and ..
CTE, linear	20.0 µm/m-°C @Temperature 1000 °C	11.1 µin/in-°F @Temperature 1830 °F
Outokumpu 4841 High Temperature Austenitic Stainless Steel Variant of 1.4845 with an increased silicon content which enhances the steel's resistance to oxidation/corrosion but has also made it more susceptible to embrittlement.Applications: Heat and creep r..
CTE, linear	20.0 µm/m-°C @Temperature 1000 °C	11.1 µin/in-°F @Temperature 1830 °F
Outokumpu 4845 High Temperature Austenitic Stainless Steel Standardized high-temperature steel for use at temperatures up to 1100°C in dry air. Prone to embrittlement after exposure between 600-900°C. Applications: Heat and creep resistance. For use o..
CTE, linear	20.0 µm/m-°C @Temperature -80.0 - 225 °C	11.1 µin/in-°F @Temperature -112 - 437 °F	(12µm polyimide/9µm copper); ASTM E831-06
NeXolve TR-Clad™ Flexible Polyimide Laminate The lightest weight copper clad laminates available.TR-Clad™ Flexible Laminates are both the lowest weight and lowest dielectric constant of copper/polyimide laminates available. Additionally, TR..
CTE, linear	20.0 µm/m-°C @Temperature >=143 °C	11.1 µin/in-°F @Temperature >=289 °F	ISO 11359
Victrex® PEEK 150GL30 30% Glass Fiber Reinforced Product Description: High performance thermoplastic material, 30% glass fibre reinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection moulding, easy flow, FDA food contact c..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Alpha 1; TMA
Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the..
CTE, linear	20.0 µm/m-°C @Temperature -50.0 - 50.0 °C	11.1 µin/in-°F @Temperature -58.0 - 122 °F	Axial; ISO 11359-2
Chevron Phillips Xtel® XE3035BL Polyphenylene Sulfide Alloy Xtel® XE3035BL is a high performance, glass fiber reinforced, PPS based alloy developed to provide exceptionally high ductility and impact resistance along with good thermal stability.Information p..
CTE, linear	20.0 µm/m-°C @Temperature -50.0 - 50.0 °C	11.1 µin/in-°F @Temperature -58.0 - 122 °F	Axial; ISO 11359-2
Chevron Phillips Xtel® XE3035NA Polyphenylene Sulfide Alloy Xtel® XE3035NA is a high performance, glass fiber reinforced, PPS based alloy developed to provide exceptionally high ductility and impact resistance along with good thermal stability.Information p..
CTE, linear	20.0 µm/m-°C @Temperature -50.0 - 50.0 °C	11.1 µin/in-°F @Temperature -58.0 - 122 °F	Axial; ISO 11359-2
Chevron Phillips Xtel® XE4050BL Polyphenylene Sulfide Alloy Xtel® XE4050BL is a glass fiber and mineral filled PPS based alloy developed to provide high ductility and impact strength along with good thermal stability.Information provided by Chevron Phillips..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 100A Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an a..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 100EN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications req..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 100VN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available i..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 200A Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an ar..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 300FPC Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick..
CTE, linear	20.0 µm/m-°C @Temperature -14.0 - 38.0 °C	11.1 µin/in-°F @Temperature 6.80 - 100 °F	25 µm film; ASTM D696-91
DuPont™ Kapton® 300HN Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 300VN Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available i..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 500A Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an ..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 500FPC Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thic..
CTE, linear	20.0 µm/m-°C @Temperature -14.0 - 38.0 °C	11.1 µin/in-°F @Temperature 6.80 - 100 °F	25 µm film; ASTM D696-91
DuPont™ Kapton® 500HN Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).Genera..
CTE, linear	20.0 µm/m-°C @Temperature -14.0 - 38.0 °C	11.1 µin/in-°F @Temperature 6.80 - 100 °F	25 µm film; ASTM D696-91
DuPont™ Kapton® 50HN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 50VN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available i..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 50ZT Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 100FPC Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick..
CTE, linear	20.0 µm/m-°C @Temperature 20.0 °C	11.1 µin/in-°F @Temperature 68.0 °F	Value for Kapton® HN
DuPont™ Kapton® 200ZT Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available in..
CTE, linear	20.0 µm/m-°C @Temperature 1000 °C	11.1 µin/in-°F @Temperature 1830 °F
Outokumpu 4948 High Temperature Austenitic Stainless Steel Creep-resistant variant of 1.4301, with a standardized minimum carbon content for service at temperatures of up to 800°C in dry air.Applications: Heat and creep resistance. For use over 550°C for..