Polymer Property : Glass Transition Temp, Tg = 108 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	42.0 °C	108 °F
Resinlab® EP1112 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib..
Glass Transition Temp, Tg	42.0 - 115 °C	108 - 239 °F	Average value: 73.8 °C Grade Count:6
Overview of materials for Epoxy Adhesive, Flexible This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Adhesive, Flexible". Each property range of values reported is minimum and maximum values of appro..
Glass Transition Temp, Tg	42.0 Â°C	108 Â°F
Styron DL 275NA Carboxylated SB Performance Features: Strength modifier, heat sealableApplications: Heat SealableNorth AmericaInformation provided by Styron
Glass Transition Temp, Tg	42.0 Â°C	108 Â°F
Styron DL 275NA Carboxylated SB Performance Features: Strength modifier, reduced blockingApplications: Sound DampeningNorth AmericaInformation provided by Styron
Glass Transition Temp, Tg	42.0 °C	108 °F
Unitika elitel UE3620 Polyester, Pellet High elongation type UE3215UNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adhesives, paints, ink binders,..
Glass Transition Temp, Tg	42.0 - 46.0 °C	108 - 115 °F	ASTM E1545-00
DSM Somos® WaterClear® Ultra 10122 Optically Clear, Colorless, Rigid, Stereolithography Resin DescriptionDSM Somos® WaterClear Ultra 10122 is a next generation optically clear resin with ABS like properties and good temperature resistance. It produces colorless, functional, accurate parts ..
Glass Transition Temp, Tg	42.0 °C	108 °F
Armstrong C-7/W Epoxy Adhesive, 2:3 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may ..
Glass Transition Temp, Tg	42.0 °C	108 °F
Resinlab® EP1112 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib..