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Resinlab® EP1112 Clear Electronic Grade Epoxy Encapsulant

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Resinlab®
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resinlab® EP1112 Clear Electronic Grade Epoxy Encapsulant.pdf
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Material Notes:
Resinlab™ EP 1112 Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. Its low viscosity allows for good wicking and penetration into components and circuitry and also gives good air release. It has very good resistance to water, acids and bases and most organic solvents. Thermal shock and cycling properties are also enhanced by its high elongation giving it the ability to absorb difference in CTE's of substrates. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP 1112 Clear will reach full cure at room temperature within 6 to 12 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 10 minutes at 100°C are typical for small castings (less than 50 grams).Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Physical Properties Metric English Comments
Specific Gravity 0.960 g/cc
0.960 g/cc
Part B
1.04 g/cc
1.04 g/cc
Mixed
1.11 g/cc
1.11 g/cc
Part A
Viscosity 1200 cP
1200 cP
Part A
1200 cP
1200 cP
Part B
1200 cP
1200 cP
Mixed
Mechanical Properties Metric English Comments
Hardness, Shore D 70
70
Tensile Strength, Ultimate 8.27 MPa
1200 psi
Tensile Strength, Yield 4.14 MPa
600 psi
Elongation at Break 50 %
50 %
Elongation at Yield 3.0 - 5.0 %
3.0 - 5.0 %
Tensile Modulus 0.138 GPa
20.0 ksi
Compressive Yield Strength 4.83 MPa
700 psi
Compressive Strength 93.1 MPa
13500 psi
Compressive Modulus 2.76 GPa
400 ksi
Adhesive Bond Strength 8.27 MPa
1200 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe
Thermal Properties Metric English Comments
CTE, linear 62.0 µm/m-°C
34.4 µin/in-°F
Thermal Conductivity 0.170 W/m-K
1.18 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Glass Transition Temp, Tg 42.0 °C
108 °F
Optical Properties Metric English Comments
Transmission, Visible 90 %
90 %
clear; thickness not quantified
Electrical Properties Metric English Comments
Volume Resistivity 4.00e+14 ohm-cm
4.00e+14 ohm-cm
Dielectric Constant 4.1

@Frequency 100 Hz,
Temperature 25.0 °C
4.1

@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 16.1 kV/mm
410 kV/in
Processing Properties Metric English Comments
Pot Life 10 - 15 min
10 - 15 min
Mass: 50g
Descriptive Properties Value Comments
Color Clear
Mix Ratio 1:1
Volume
100:85
Weight
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