Songhan Plastic Technology Co.,Ltd.

Master Bond EP21TDCS Silver Filled Electrically Conductive Epoxy Compound

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP21TDCS Silver Filled Electrically Conductive Epoxy Compound.pdf
  Online Service   lookpolymers   27660005
Material Notes:
Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, the EP21TDCS has a one-to-one mix ratio, by weight or volume.
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -269 °C
-453 °F
Processing Properties Metric English Comments
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
1440 - 2160 min

@Temperature 23.0 °C
24.0 - 36.0 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Silver; "B" Silver
Mix Ratio By Weight 100/100
Set-Up Time, minutes 30-40
At Room Temperature
Viscosity Smooth Paste
Room Temperature
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