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Master Bond EP50-1.5 Fast Setting, Fast Curing Two Component Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive , Epoxy, Thermally Conductive
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP50-1.5 Fast Setting, Fast Curing Two Component Epoxy Adhesive.pdf
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Material Notes:
Master Bond Polymer Adhesive EP50-1.5 is an exceptionally fast setting, fast curing two component epoxy. EP50-1.5, for general purpose bonding, is formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature.
Physical Properties Metric English Comments
Viscosity 8000 - 10000 cP

@Temperature 23.0 °C
8000 - 10000 cP

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -269 °C
-453 °F
Processing Properties Metric English Comments
Cure Time 120 - 180 min

@Temperature 23.0 °C
2.00 - 3.00 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Clear; "B" Clear Yellow
Mix Ratio By Weight 100/100
Set-Up Time, minutes 1.5-2
At Room Temperature
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