Polymer Property : Compressive Strength = 203 MPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Compressive Strength	203 MPa @Temperature 25.0 Â°C	29400 psi @Temperature 77.0 Â°F
Lord Adhesives Circalokâ„¢ 6037 Epoxy Adhesive Circalokâ„¢ 6037 is an epoxy adhesive formulated for use by the semiconductor industry. An easy-to-spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of ther..
Compressive Strength	203 MPa @Thickness 12.7 mm	29500 psi @Thickness 0.500 in	ASTM D695
Industrial Laminates/Norplex NP625 Paper Base Laminate Description: Paper phenolic grade with better moisture resistance than NP612. Requires less heat to punch and shear than NP611.
Compressive Strength	203 MPa	29500 psi
SGL Carbon Group RiduridÂ® V 1352 High Performance Graphite Filled Plastic Good mechanical strength, good sliding properties, high temperature resistance, high thermal shock resistance, low wettability, high corrosion resistance, high thermal conductivity, high purity, and..
Compressive Strength	203 MPa	29400 psi	ASTM D695
Sumitomo Bakelite North America E 264H Long Glass Fiber Reinforced Epoxy E 264H is a high strength, long fiberglass reinforced epoxy molding compound, which features improved flow in transfer molding.Information provided by Sumitomo Bak North America, Inc.
Compressive Strength	203 MPa	29400 psi	ASTM D695
Plenco 4301 Phenolic, Granular, Compression Molded PLENCO 04301 is a heat resistant, mineral filled phenolic molding compound offering excellent dimensional stability and electrical properties. UL recognized under component file E40654. 04301 is ava..
Compressive Strength	203 MPa	29400 psi	ASTM D695
Plenco 2311 Phenolic, Granular, Transfer Molded PLENCO 02311 is a versatile general purpose organic filled phenolic molding compound offering excellent mold processability and optimized cure cycles. PLENCO 02311 is also granulated to provide impr..