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Lord Adhesives Circalokâ„¢ 6037 Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Thermally Conductive
Manufacturer Lord Adhesives
Trade Name Circalok™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Lord Adhesives Circalokâ„¢ 6037 Epoxy Adhesive.pdf
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Material Notes:
Circalok™ 6037 is an epoxy adhesive formulated for use by the semiconductor industry. An easy-to-spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of thermal expansion comparable to that of copper and aluminum. Its strong bond to a wide variety of substrates resists severe temperature cycling. This adhesive is principally used to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices. When used to bond semiconductors to heat sinks, it also serves as an electrical insulator; but the semiconductor’s mating surfaces should be precoated with E-343 and allowed to cure to insure the dielectric integrity of the epoxy interface.All information provided by Lord.
Physical Properties Metric English Comments
Specific Gravity 2.30 - 2.40 g/cc

@Temperature 25.0 °C
2.30 - 2.40 g/cc

@Temperature 77.0 °F
Water Absorption 0.15 %

@Temperature 25.0 °C
0.15 %

@Temperature 77.0 °F
10 days
Linear Mold Shrinkage 0.0020 cm/cm
0.0020 in/in
Mechanical Properties Metric English Comments
Hardness, Shore D 92 - 94
92 - 94
Tensile Strength, Yield 72.4 MPa

@Temperature 25.0 °C
10500 psi

@Temperature 77.0 °F
Elongation at Yield 1.4 - 1.6 %
1.4 - 1.6 %
Compressive Strength 203 MPa

@Temperature 25.0 °C
29400 psi

@Temperature 77.0 °F
Shear Strength 20.2 MPa

@Temperature 25.0 °C
2930 psi

@Temperature 77.0 °F
After 30 days in H20
26.5 MPa

@Temperature 25.0 °C
3840 psi

@Temperature 77.0 °F
Bond; Aluminum to aluminum, 1" overlap
Izod Impact, Notched 0.160 J/cm
0.300 ft-lb/in
Thermal Properties Metric English Comments
CTE, linear 22.0 µm/m-°C
12.2 µin/in-°F
Thermal Conductivity 1.40 W/m-K
9.72 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 155 °C
311 °F
Continuous
250 °C
482 °F
Intermittent
Heat Distortion Temperature 155 °C
311 °F
Minimum Service Temperature, Air -100 °C
-148 °F
Intermittent
-65.0 °C
-85.0 °F
Continuous
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+16 ohm-cm

@Temperature 25.0 °C
1.00e+16 ohm-cm

@Temperature 77.0 °F
Dielectric Constant 6.1

@Frequency 1.00e+7 Hz,
Temperature 25.0 °C
6.1

@Frequency 1.00e+7 Hz,
Temperature 77.0 °F
Dielectric Strength 39.4 - 78.7 kV/mm

@Thickness 0.0762 mm
1000 - 2000 kV/in

@Thickness 0.00300 in
Dissipation Factor 0.020

@Frequency 1.00e+7 Hz,
Temperature 25.0 °C
0.020

@Frequency 1.00e+7 Hz,
Temperature 77.0 °F
Processing Properties Metric English Comments
Shelf Life 12.0 Month

@Temperature 21.0 - 27.0 °C
12.0 Month

@Temperature 69.8 - 80.6 °F
Descriptive Properties Value Comments
Appearance Black or Green
Consistency Paste
Thermal Resistance (ºC-in/W) 28
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