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Cookson Group Plaskon® ULS-12 Epoxy Encapsulant  (discontinued **)

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® ULS-12 Epoxy Encapsulant  (discontinued **).pdf
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Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.A state-of-the-art, ultra low stress epoxy encapsulant designed for packaging large, stress-sensitive DIPs, PLCCs and QFPs. It is formulated with a unique filler system that reduces the expansion coefficient without compromising moldability. Ultra low stress properties; Outstanding moldability (good mold filling, low wire sweep, fast cycles and good hot hardness); Superior reliability
Physical Properties Metric English Comments
Density 1.88 g/cc
0.0679 lb/in³
Water Absorption 0.0034 %
0.0034 %
Viscosity 5500 cP

@Temperature 175 °C
5500 cP

@Temperature 347 °F
Automatic orifice Viscosity
Linear Mold Shrinkage 0.0025 cm/cm
0.0025 in/in
Spiral Flow 81.0 cm
31.9 in
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Flexural Strength 107 MPa
15500 psi
Flexural Modulus 14.0 GPa
2030 ksi
Thermal Properties Metric English Comments
CTE, linear 12.5 µm/m-°C

@Temperature 20.0 °C
6.94 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 65.0 µm/m-°C

@Temperature 20.0 °C
36.1 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K
4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 168 °C
334 °F
Flammability, UL94 V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
Electrical Properties Metric English Comments
Dielectric Constant 3.8

@Frequency 1000 Hz
3.8

@Frequency 1000 Hz
Dielectric Strength 16.0 kV/mm
406 kV/in
Dissipation Factor 0.0020

@Frequency 1000 Hz
0.0020

@Frequency 1000 Hz
Arc Resistance 180 sec
180 sec
Processing Properties Metric English Comments
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
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