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- Polymer Property : Viscosity = 22000 cP
Polymer Property : Viscosity = 22000 cP Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Viscosity | 22000 cP @Shear Rate 11200 1/s, Temperature 200 °C |
22000 cP @Shear Rate 11200 1/s, Temperature 392 °F |
ASTM D3835 |
| PolyOne Dynaflex™ G2780-0001 Thermoplastic Elastomer (TPE) Dynaflex™ G2780-0001 is an easy processing TPE designed for injection molding and extrusion applications that require FDA compliance. - Excellent Colorability - Good Ozone and UV Stability - Overmo.. |
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| Viscosity | 22000 cP @Shear Rate 11200 1/s, Temperature 200 °C |
22000 cP @Shear Rate 11200 1/s, Temperature 392 °F |
ASTM D3835 |
| PolyOne Dynaflex™ G2780C Thermoplastic Elastomer (TPE) Dynaflex™ G2780C is an easy processing TPE designed for injection molding and extrusion applications that require FDA compliance. - Excellent Colorability - Good Ozone and UV Stability - Overmold A.. |
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| Viscosity | 22000 - 27000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
22000 - 27000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
| Gwent Electronic Materials C2110817D5 Conductive Silver Polymer Paste This product is a thermoplastic screen printing ink, developed for use in membrane touch switch applications as well as counter electrode in electro-chemical sensors and conductive tracks. It may b.. |
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| Viscosity | 22000 cP | 22000 cP | 2.7% NaCl added |
| Solvay MACKADET® SBC--8 Surfactant Product Description: Mackadet SBC-8 is a concentrated blend of mild surfactants for use as a base for high foaming surfactant systems. Mackadet SBC-8 responds rapidly to viscosity building with the .. |
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| Viscosity | 22000 cP @Temperature 25.0 °C |
22000 cP @Temperature 77.0 °F |
After mixing |
| Tra-Con Tra-Bond 2170T Flexible Plastic Bonder TRA-BOND 2170T is a flexible, high viscosity, thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or alm.. |
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| Viscosity | 22000 cP @Temperature 25.0 °C |
22000 cP @Temperature 77.0 °F |
After mixing |
| Tra-Con Tra-Bond FS420 Flexible Plastic Adhesive TRA-BOND FS-420 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or almost any thermopl.. |
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| Viscosity | 22000 cP | 22000 cP | dynamic |
| Dow Corning SE 4447 CV KIT Two-part liquid silicone elastomer designed for applications requiring very high thermal conductivity and electrical insulation.Information provided by Dow Corning |
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| Viscosity | 22000 cP | 22000 cP | |
| Cotronics Duralco™ 132 500°F (260°C) Aluminum Filled Epoxy Aluminum filled epoxy that cures at room temperature to form machinable, thermally conductive bond lines. High heat transfer. Can be supplied as a “non-sag” putty.Applications: heat tacking, hea.. |
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| Viscosity | 22000 - 26000 cP @Temperature 23.0 °C |
22000 - 26000 cP @Temperature 73.4 °F |
10 rpm |
| Epoxy Technology EPO-TEK® E3037 Epoxy Material Description: A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.Information Provided by Epoxy Technolo.. |
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| Viscosity | 22000 - 28000 cP @Temperature 23.0 °C |
22000 - 28000 cP @Temperature 73.4 °F |
10 rpm |
| Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec.. |
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| Viscosity | 22000 - 26000 cP @Temperature 23.0 °C |
22000 - 26000 cP @Temperature 73.4 °F |
10 rpm |
| Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av.. |
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| Viscosity | 22000 cP | 22000 cP | dynamic |
| Dow Corning SE 4446 CV KIT Two-part, grey, 1:1, addition cure gel, good thermal conductivity, controlled volatility.Information provided by Dow Corning |
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| Viscosity | 22000 - 28000 cP @Temperature 23.0 °C |
22000 - 28000 cP @Temperature 73.4 °F |
10 rpm |
| Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
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| Viscosity | 22000 cP | 22000 cP | Mixed |
| Armstrong C-7/W Epoxy Adhesive, 1:1 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may .. |
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| Viscosity | 22000 cP | 22000 cP | mixed |
| Aremco Ceramacast™ 895 High Temperature Potting & Casting Material Alumina Fine grain castable ceramic. |
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