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Polymer Property : Viscosity = 28000 cP Product List

Physical Properties

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Physical Properties Metric English Comments
Viscosity 14000 - 28000 cP
14000 - 28000 cP
Part B
Master Bond EP21TPFL-1AO Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System
Product Description: Master Bond EP21TPFL-1AO is a two component, low viscosity epoxy polysulfide for high performance bonding, sealing, coating and casting offering thermal conductivity, electrical..
Viscosity 22000 - 28000 cP

@Temperature 23.0 °C
22000 - 28000 cP

@Temperature 73.4 °F
10 rpm
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
Viscosity 22000 - 28000 cP

@Temperature 23.0 °C
22000 - 28000 cP

@Temperature 73.4 °F
10 rpm
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive
Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
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