Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy, Novolac, Molding Compound
Manufacturer
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.A flame retardant, novolac-hardened epoxy molding compound recommended for semiconductor packages that are not stress sensitive.

Physical Properties	Metric	English	Comments
Density	1.92 g/cc	0.0694 lb/in³
Linear Mold Shrinkage	0.0050 - 0.0070 cm/cm	0.0050 - 0.0070 in/in
Spiral Flow	64.0 - 90.0 cm	25.2 - 35.4 in	177°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	78	78
Tensile Strength, Ultimate	103 MPa	14900 psi
Tensile Modulus	16.0 GPa	2320 ksi
Flexural Strength	145 MPa	21000 psi
Flexural Modulus	17.0 GPa	2470 ksi
Izod Impact, Notched	0.250 J/cm	0.468 ft-lb/in

Thermal Properties	Metric	English
CTE, linear, Parallel to Flow	27.0 µm/m-°C @Temperature 20.0 °C	15.0 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	81.0 µm/m-°C @Temperature 20.0 °C	45.0 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F
Deflection Temperature at 1.8 MPa (264 psi)	218 °C	424 °F
Glass Transition Temp, Tg	150 - 160 °C	302 - 320 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Electrical Properties	Metric	English
Dielectric Constant	4.08 @Frequency 1000 Hz	4.08 @Frequency 1000 Hz
Dielectric Strength	17.0 kV/mm	432 kV/in
Dissipation Factor	0.0040 @Frequency 1000 Hz	0.0040 @Frequency 1000 Hz

Processing Properties	Metric	English	Comments
Processing Temperature	171 - 193 °C	340 - 379 °F	Molding temperature

Users viewing this material also viewed the following: