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Tra-Con Tra-Bond 2129 Clear Low Viscosity Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond 2129 Clear Low Viscosity Epoxy Adhesive.pdf
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Material Notes:
TRA-BOND 2129 is a low viscosity epoxy adhesive recommended for industrial and electronic production, repair, small casting, coating, tooling, and rigid laminating applications where a clear system with good mechanical and electrical properties is required. This easy-to-use epoxy adhesive cures at room temperature and develops strong, low shrinkage bonds to most materials - metals, ceramics and ceramic inserts, glass and glass fabrics, wood and many rigid plastics. Fully cured TRA-BOND 2129 is an effective electrical insulator with good low temperature mechanical and impact resistance properties, and outstanding resistance to water, most petroleum products, salt solutions, mild acids and alkalis and many other organic and inorganic compounds.Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 1.19 g/cc
1.19 g/cc
Mixed
Solids Content 100 %
100 %
Reactive Solids Content
Viscosity 1900 cP

@Temperature 25.0 °C
1900 cP

@Temperature 77.0 °F
After mixing
Mechanical Properties Metric English Comments
Hardness, Shore D 88
88
Adhesive Bond Strength 6.89 MPa
1000 psi
Lap shear, alum to alum
Izod Impact, Notched 0.256 J/cm
0.480 ft-lb/in
Thermal Properties Metric English Comments
CTE, linear 58.0 µm/m-°C

@Temperature 20.0 °C
32.2 µin/in-°F

@Temperature 68.0 °F
Maximum Service Temperature, Air 140 °C
284 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Glass Transition Temp, Tg 95.0 °C
203 °F
Ultimate Tg
Optical Properties Metric English Comments
Transmission, Visible 90 %
90 %
clear; thickness not quantified
Electrical Properties Metric English Comments
Volume Resistivity 5.90e+13 ohm-cm
5.90e+13 ohm-cm
9.50e+9 ohm-cm

@Temperature 100 °C
9.50e+9 ohm-cm

@Temperature 212 °F
Dielectric Constant 4.0

@Frequency 1000 Hz
4.0

@Frequency 1000 Hz
Dielectric Strength 16.1 kV/mm
410 kV/in
Dissipation Factor 0.020

@Frequency 1000 Hz
0.020

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 240 min

@Temperature 65.0 °C
4.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 30 min
30 min
Descriptive Properties Value Comments
Color Clear, Transparent
Mix Ratio, parts by weight 100/25
Resin/Hardener
Thixotropic Index 1
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