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Sumitomo Bakelite North America TEM 9053C Hardware Grade Epoxy

Category Polymer , Thermoset , Epoxy , Filled/Reinforced Thermoset
Manufacturer Sumitomo Bakelite North America
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Sumitomo Bakelite North America TEM 9053C Hardware Grade Epoxy.pdf
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Material Notes:
Short fiberglass and mineral filled, toughened epoxy molding compound with excellent dimensional stability and high strength properties.Information provided by Vyncolit, a Sumitomo Bak Group
Physical Properties Metric English Comments
Bulk Density 0.850 g/cc
0.0307 lb/in³
Powder Density; ASTM D1895
Density 1.95 g/cc
0.0704 lb/in³
Relative Density; ASTM D792
Water Absorption 0.050 %

@Temperature 23.0 °C,
Time 86400 sec
0.050 %

@Temperature 73.4 °F,
Time 24.0 hour
ASTM D570
Linear Mold Shrinkage 0.0025 cm/cm
0.0025 in/in
Compression Molding; ASTM D955
Mechanical Properties Metric English Comments
Hardness, Rockwell M 70
70
ASTM D2583
Tensile Strength at Break 100 MPa
14500 psi
ASTM D638
Flexural Strength 160 MPa
23200 psi
At Rupture; ASTM D790
Flexural Modulus 16.6 GPa
2410 ksi
ASTM D790
Compressive Strength 235 MPa
34100 psi
ASTM D695
Izod Impact, Notched 0.270 J/cm
0.506 ft-lb/in
ASTM D256
Thermal Properties Metric English Comments
CTE, linear, Parallel to Flow 26.0 µm/m-°C

@Temperature 20.0 °C
14.4 µin/in-°F

@Temperature 68.0 °F
ASTM E-831
Thermal Conductivity 0.710 W/m-K
4.93 BTU-in/hr-ft²-°F
ASTM C-518
Deflection Temperature at 1.8 MPa (264 psi) 160 °C
320 °F
Post Baked; ASTM D648A
Electrical Properties Metric English Comments
Dielectric Constant 4.2

@Frequency 1e+6 Hz
4.2

@Frequency 1e+6 Hz
Wet; ASTM D150
Dielectric Strength 14.0 kV/mm
356 kV/in
60Hz, Step-by-Step, wet; ASTM D149
16.0 kV/mm
406 kV/in
60Hz, Short Time, wet; ASTM D149
Dissipation Factor 0.015

@Frequency 1e+6 Hz
0.015

@Frequency 1e+6 Hz
wet; ASTM D150
Arc Resistance 180 sec
180 sec
ASTM D495
Descriptive Properties Value Comments
Color Black
Form Granular
Main Filler Glass Fiber & Mineral
Molding Method Compression, transfer, injection
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