Sumitomo Bakelite North America E 8354-19189-2 Electrical Encapsulation Grade Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Encapsulating, Glass or Mineral Filled , Epoxy, High Temperature , Filled/Reinforced Thermoset
Manufacturer	Sumitomo Bakelite North America
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Sumitomo Bakelite North America E 8354-19189-2 Electrical Encapsulation Grade Epoxy.pdf
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Material Notes:

Glass and mineral reinforced epoxy molding compound, formulated for the encapsulation of devices requiring high quality and thermal shock resistance.Information provided by Vyncolit, a Sumitomo Bak Group

Physical Properties	Metric	English	Comments
Bulk Density	0.800 g/cc	0.0289 lb/inÂ³	Powder Density; ASTM D1895
Density	1.84 g/cc	0.0665 lb/inÂ³	Relative Density; ASTM D792
Linear Mold Shrinkage	0.0030 - 0.0035 cm/cm	0.0030 - 0.0035 in/in	Compression Molding; ASTM D955

Mechanical Properties	Metric	English	Comments
Tensile Strength at Break	72.0 MPa	10400 psi	ASTM D638
Flexural Strength	124 MPa	18000 psi	At Rupture; ASTM D790
Flexural Modulus	16.5 GPa	2390 ksi	ASTM D790
Compressive Strength	210 MPa	30500 psi	ASTM D695
Izod Impact, Notched	0.240 J/cm	0.450 ft-lb/in	ASTM D256

Thermal Properties	Metric	English	Comments
CTE, linear, Parallel to Flow	17.0 Âµm/m-Â°C @Temperature 20.0 Â°C	9.44 Âµin/in-Â°F @Temperature 68.0 Â°F	ASTM E-831
Deflection Temperature at 1.8 MPa (264 psi)	>= 282 Â°C	>= 540 Â°F	Post Baked; ASTM D648A

Electrical Properties	Metric	English	Comments
Dielectric Constant	4.8 @Frequency 1e+6 Hz	4.8 @Frequency 1e+6 Hz	Dry; ASTM D150
Dielectric Strength	14.7 kV/mm	373 kV/in	60Hz, Short Time, dry; ASTM D149
Dissipation Factor	0.014 @Frequency 1e+6 Hz	0.014 @Frequency 1e+6 Hz	Dry; ASTM D150
Arc Resistance	180 sec	180 sec	ASTM D495

Descriptive Properties	Value	Comments
Color	Black
Form	Granular
Main Filler	Glass Fiber & Mineral
Molding Method	Compression, transfer

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